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Controlling the B/Ti ratio of TiBx thin films grown by high-power impulse magnetron sputtering
Linköpings universitet, Institutionen för fysik, kemi och biologi, Tunnfilmsfysik. Linköpings universitet, Tekniska fakulteten.
Linköpings universitet, Institutionen för fysik, kemi och biologi, Tunnfilmsfysik. Linköpings universitet, Tekniska fakulteten. Univ Illinois, IL 61801 USA; Univ Illinois, IL 61801 USA.
Linköpings universitet, Institutionen för fysik, kemi och biologi, Tunnfilmsfysik. Linköpings universitet, Tekniska fakulteten. Univ Illinois, IL 61801 USA; Univ Illinois, IL 61801 USA.
Linköpings universitet, Institutionen för fysik, kemi och biologi, Tunnfilmsfysik. Linköpings universitet, Tekniska fakulteten.ORCID-id: 0000-0002-2837-3656
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2018 (engelsk)Inngår i: Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, ISSN 0734-2101, E-ISSN 1520-8559, Vol. 36, nr 3, artikkel-id 030604Artikkel i tidsskrift (Fagfellevurdert) Published
Abstract [en]

TiBx thin films grown from compound TiB2 targets by magnetron sputter deposition are typically highly over-stoichiometric, with x ranging from 3.5 to 2.4, due to differences in Ti and B preferential-ejection angles and gas-phase scattering during transport from the target to the substrate. Here, the authors demonstrate that stoichiometric TiB2 films can be obtained using highpower impulse magnetron sputtering (HiPIMS) operated in power-controlled mode. The B/Ti ratio x of films sputter-deposited in Ar is controllably varied from 2.08 to 1.83 by adjusting the length of HiPIMS pulses t(on) between 100 and 30 mu s, while maintaining average power and pulse frequency constant. This results in peak current densities J(T), peak ranging from 0.27 to 0.88 A/cm(2). Energy- and time-resolved mass spectrometry analyses of the ion fluxes incident at the substrate position show that the density of metal ions increases with decreasing t(on) due to a dramatic increase in J(T, peak) resulting in the strong gas rarefaction. With t(on)amp;lt;60 mu s (J(T),(peak)amp;gt; 0.4 A/cm(2)), film growth is increasingly controlled by ions incident at the substrate, rather than neutrals, as a result of the higher plasma dencity and, hence, electron-impact ionization probablity. Thus, since sputter- ejected Ti atoms have a higher probability of being ionized than B atoms, due to their lower first-ionization potential and larger ionization cross-section, the Ti concentration in as-deposited films increases with decreasing ton (increasing J(T,peak)) as ionized sputtered species are steered to the substrate by the plasma in order to maintain charge neutrality. Published by the AVS.

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A V S AMER INST PHYSICS , 2018. Vol. 36, nr 3, artikkel-id 030604
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URN: urn:nbn:se:liu:diva-148101DOI: 10.1116/1.5026445ISI: 000432372400013OAI: oai:DiVA.org:liu-148101DiVA, id: diva2:1211328
Merknad

Funding Agencies|Swedish Research Council VR [2014-5790, 642-2013-8020]; Knut and Alice Wallenberg foundation [KAW 2015.0043]; Aforsk foundation [16-359]; Carl Tryggers Stiftelse Contract [CTS 15:219, CTS 17:166, CTS 14:431]; Swedish Government Strategic Research Area in Materials Science on Functional Materials at Linkoping University (Faculty Grant SFO Mat LiU) [2009 00971]

Tilgjengelig fra: 2018-05-30 Laget: 2018-05-30 Sist oppdatert: 2018-07-02

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Bakhit, BabakPetrov, IvanGreene, Joseph EHultman, LarsRosén, JohannaGreczynski, Grzegorz
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