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Influence of ultrasound and cathode rotation on the formation of intrinsic stress in Ni films during electrodeposition
Linköpings universitet, Institutionen för fysik, kemi och biologi, Tunnfilmsfysik. Linköpings universitet, Tekniska högskolan.
SP Technical Research Institute of Sweden AB, Box 857, 501 15 Borås Sweden/School of Engineering Jönköping University, Sweden.
Linköpings universitet, Institutionen för fysik, kemi och biologi, Tunnfilmsfysik. Linköpings universitet, Tekniska högskolan.ORCID-id: 0000-0001-9140-6724
ENKOTEC A/S, Denmark.
Vise andre og tillknytning
2011 (engelsk)Inngår i: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 89, nr 3, s. 137-142Artikkel i tidsskrift (Fagfellevurdert) Published
Abstract [en]

The influence of 25 kHz ultrasound and cathode rotation during electroplating of Ni films on Si wafers has been studied with respect to intrinsic stress formation. Current densities from 1.6 A dm-2 up to 28.3 A dm-2 were used in an additive-free Ni sulphamate electrolyte. In general more efficient agitation by either ultrasound or cathode rotation was found to reduce intrinsic stress towards compressive levels compared to conventional agitation with an electrolyte circulation pump. Further more, intrinsic stresses become less dependent on changes in current density. The latter effect is most pronounced for ultrasonic agitation. Structure analysis of samples deposited by ultrasonic agitation show dense deposits with initially smaller grains at high ultrasonic effect. Locally increased temperature at the substrates surface could be an important effect of ultrasound agitation.

sted, utgiver, år, opplag, sider
Institute of Metal Finishing , 2011. Vol. 89, nr 3, s. 137-142
Emneord [en]
Intrinsic stress; Electrodeposition; Ultrasound; Nickel; Electroforming
HSV kategori
Identifikatorer
URN: urn:nbn:se:liu:diva-63622DOI: 10.1179/002029611X13014892461794ISI: 000291382200005OAI: oai:DiVA.org:liu-63622DiVA, id: diva2:381736
Tilgjengelig fra: 2010-12-28 Laget: 2010-12-28 Sist oppdatert: 2017-12-11bibliografisk kontrollert
Inngår i avhandling
1. Surface Technology for Optical and Electrical Connectors
Åpne denne publikasjonen i ny fane eller vindu >>Surface Technology for Optical and Electrical Connectors
2010 (engelsk)Doktoravhandling, med artikler (Annet vitenskapelig)
Abstract [en]

This thesis treats surface engineering with the purpose of improved quality of optical and electricalconnectors with a focus on electroplated and magnetron sputtered materials. In electroforming of tools formanufacturing optical connectors, the influence of ultrasonic agitation on intrinsic stresses and fillingproperties of electroplated Ni has been studied. It is established that the ultrasonic agitation at the substratesurface during deposition impacts the intrinsic stresses making it possible to increase deposition rate viacurrent density, with stress-free or low-stress levels in the Ni layers. Reduced variations of the intrinsicstress over the surface with the current density is a further important result. Filling of grooves byelectroplating of Ni using ultrasonic agitation is demonstrated. This is due to increasing mass transport ofspecies into the grooves compared to conventional pumped agitation. The enhanced filling propertiesmakes it possible to electroplate Ni in the bottom of high-aspect-ratio grooves. In order to industriallyimplement new nanocomposite coatings on electronic connectors, studies have been performed regardingthe thermal diffusion barrier properties against Cu for Ti-Si-C and Ti-Si-C-Ag nanocomposites, depositeddirectly onto Cu substrates or with sputtered Ni, Ti or electroplated Ni as an intermediate coating. Theapplication of an electroplated Ni diffusion barrier coating, hinders Cu from reaching the surface of thenanocomposites. Also, Ti-Si-C-Ag nanocomposite deposited on magnetron sputtered Ni or Ti on Cusubstrates hinder Cu from diffusing to the surface after annealing. The contact resistance of Ag-Pdtopcoated Ti-Si-C-Ag-Pd and Ti-Si-C-Ag nanocomposite coatings in contact with hard gold is shown tocompete with hard gold in contact with itself, as electrical contact coatings at contact forces around 5 N.Ag-Pd topcoated Ti-Si-C-Ag-Pd in contact with hard gold is shown to have approximately the same contactresistance as hard gold in contact with hard gold at contact forces around 0.1 N, which here is in the 10 mΩrange, while Ti-Si-C-Ag nanocomposite coatings in contact with hard gold has a contact resistance that isup to 10 times higher. The overall contribution of this thesis can be summarised as a deeper knowledge andunderstanding of techniques and coatings, that help reduce cost and increase reliability of electronics.

sted, utgiver, år, opplag, sider
Linköping: Linköping University Electronic Press, 2010. s. 73
Serie
Linköping Studies in Science and Technology. Dissertations, ISSN 0345-7524 ; 1342
HSV kategori
Identifikatorer
urn:nbn:se:liu:diva-63626 (URN)978-91-7393-299-8 (ISBN)
Disputas
2010-11-26, Planck, Fysikhuset, Campus Valla, Linköpings universitet, Linköping, 10:15 (svensk)
Opponent
Veileder
Tilgjengelig fra: 2010-12-28 Laget: 2010-12-28 Sist oppdatert: 2020-02-19bibliografisk kontrollert

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