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Efficient Test Application for Rapid Multi-Temperature Testing
Linköpings universitet, Institutionen för datavetenskap, Programvara och system. Linköpings universitet, Tekniska fakulteten.
Linköpings universitet, Institutionen för datavetenskap, Programvara och system. Linköpings universitet, Tekniska fakulteten.
Linköpings universitet, Institutionen för datavetenskap, Programvara och system. Linköpings universitet, Tekniska fakulteten.
2015 (engelsk)Inngår i: Proceedings of the 25th edition on Great Lakes Symposium on VLSI, Association for Computing Machinery (ACM), 2015, s. 3-8Konferansepaper, Publicerat paper (Annet vitenskapelig)
Abstract [en]

Different defects may manifest themselves at different temperatures. Therefore, the tests that target such temperature-dependent defects must be applied at different temperatures appropriate for detecting them. Such multi-temperature testing scheme applies tests at different required temperatures. It is known that a test's power dissipation depends on the previously applied test. Therefore, the same set of tests when organized differently dissipates different amounts of power. The technique proposed in this paper organizes the tests efficiently so that the resulted power levels lead to the required temperatures. Consequently a rapid multi-temperature testing is achieved. Experimental studies demonstrate the efficiency of the proposed technique.

sted, utgiver, år, opplag, sider
Association for Computing Machinery (ACM), 2015. s. 3-8
Emneord [en]
Temperature-dependent defects, multi-temperature testing, temperature simulation, test ordering, test scheduling, 3D stacked IC (3D-SIC)
HSV kategori
Identifikatorer
URN: urn:nbn:se:liu:diva-129003DOI: 10.1145/2742060.2742064ISBN: 978-1-4503-3474-7 (tryckt)OAI: oai:DiVA.org:liu-129003DiVA, id: diva2:934137
Konferanse
Great Lakes Symposium on VLSI, Pittsburgh, Pennsylvania, USA, May 20-22, 2015
Tilgjengelig fra: 2016-06-08 Laget: 2016-06-08 Sist oppdatert: 2018-01-10bibliografisk kontrollert

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