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Optical interconnects and high frequency electronic packaging: SBU-materials, material characterization, LAP- & microprocessing
Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
2003 (English)Licentiate thesis, comprehensive summary (Other academic)
Place, publisher, year, edition, pages
Linköping: Linköpings universitet , 2003. , p. 178
Series
Linköping Studies in Science and Technology. Thesis, ISSN 0280-7971 ; 1063
National Category
Physical Sciences
Identifiers
URN: urn:nbn:se:liu:diva-144770Local ID: LiU-TEK-LIC-2003:62ISBN: 9173738751 (print)OAI: oai:DiVA.org:liu-144770DiVA: diva2:1178951
Available from: 2018-01-31 Created: 2018-01-31 Last updated: 2018-02-12Bibliographically approved

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Uhlig, Steffen

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