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Raspberry pi to backplane through SGMII
Linköping University, Department of Science and Technology, Physics and Electronics. Linköping University, The Institute of Technology.
Linköping University, Department of Science and Technology, Physics and Electronics. Linköping University, The Institute of Technology.
2018 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

This thesis explores a method on how communication with a backplane through SGMII via a Raspberry Pi Compute Module 3 is achieved. The thesis focuses on the steps required to design a carrier board that can mount the module and incorporate a bridge between SGMII and USB. The different steps required to achieve this were to find the components, design a power solution, draw the schematics and eventually designing the PCB.

Place, publisher, year, edition, pages
2018. , p. 31
Keywords [en]
Raspberry Pi, SGMII, USB, WISI, Carrier Board, Examensarbete, PCB, LiU
National Category
Other Engineering and Technologies not elsewhere specified
Identifiers
URN: urn:nbn:se:liu:diva-150129ISRN: LiU-ITN-TEK-A--18/019--SEOAI: oai:DiVA.org:liu-150129DiVA, id: diva2:1238538
Subject / course
Electrical Engineering
Uppsok
Technology
Supervisors
Examiners
Available from: 2018-08-14 Created: 2018-08-14 Last updated: 2018-08-14Bibliographically approved

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Raspberry pi to backplane through SGMII(2206 kB)1098 downloads
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311cf6307ef55960ffcf18f4c8c09d51d8585e9915bac45378f44c79929bc3cf2406265e336be5809f71fae9a80337f83b3490886f919211f5fb4e808848362e
Type fulltextMimetype application/pdf

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Lundström, PetterToma, Josef
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CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf