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The 2019 Embedded Systems Week (ESWEEK)
Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, Faculty of Science & Engineering.
Natl Univ Singapore, Singapore.
2020 (English)In: IEEE design & test, ISSN 2168-2356, E-ISSN 2168-2364, Vol. 37, no 1, p. 100-101Article in journal, Editorial material (Other academic) Published
Abstract [en]

n/a

Place, publisher, year, edition, pages
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC , 2020. Vol. 37, no 1, p. 100-101
National Category
Computer and Information Sciences
Identifiers
URN: urn:nbn:se:liu:diva-164388DOI: 10.1109/MDAT.2019.2952345ISI: 000515556300010OAI: oai:DiVA.org:liu-164388DiVA, id: diva2:1415849
Note

Funding Agencies|ACM Special Interest Group on Embedded Systems (SIGBED); ACM SIGDA; IEEE Council on Electronic Design Automation (CEDA); National Science Foundation (NSF) ESWEEK Opportunity ProgramsNational Science Foundation (NSF); SIGBED childcare

Available from: 2020-03-20 Created: 2020-03-20 Last updated: 2020-03-20

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