3D EVALUATION OF THERMAL STRESSES ON CERAMIC-METAL COMPOSITES USED AT HIGH TEMPERATURE OPERATION
2017 (English)In: 5TH IIR INTERNATIONAL CONFERENCE ON THERMOPHYSICAL PROPERTIES AND TRANSFER PROCESSES OF REFRIGERANTS (TPTPR), INT INST REFRIGERATION , 2017, p. 771-775Conference paper, Published paper (Refereed)
Abstract [en]
Ceramic-metal composites (CMC) have been used for various high temperature applications including combustion engines, steam and gas turbines, industrial heaters and ceramic fuel cells. Reliable incorporation of the CMC at elevated temperatures, however, is very difficult in practice for the following reasons. First, meting and sublimation points of those solids are different causing undesired diffusion and mixing of elements across the material boundaries degrading functions of the materials. Secondly, maintaining temperature and pressure regimes for desired phases of the component materials is challenging during operation in many of practical cases. Lastly, thermal expansion rates of those two materials are significantly different frequently causing mechanical stresses and fractures. There have been numerous efforts to evaluate and design the CMC materials to minimize the thermo-mechanical stresses. Among various techniques, the focused ion beam-scanning electron microscope (FIB-SEM) tomography has been proved as a state-of-art technique to obtain 3D compositional and structural information of the CMC materials. In this study, we have evaluated thermal stresses applied on nickel-zirconia CMCs by using the FIB-SEM 3D tomography and finite element analysis.
Place, publisher, year, edition, pages
INT INST REFRIGERATION , 2017. p. 771-775
Series
Refrigeration Science and Technology, ISSN 0151-1637
Keywords [en]
Focused Ion Beam; Scanning Electron Microscope; Composite; Ceramic; Metal
National Category
Energy Engineering
Identifiers
URN: urn:nbn:se:liu:diva-177295DOI: 10.18462/iir.tptpr.2017.0017ISI: 000534253100013ISBN: 978-2-36215-020-3 (electronic)OAI: oai:DiVA.org:liu-177295DiVA, id: diva2:1572549
Conference
5th IIR International Conference on Thermophysical Properties and Transfer Processes of Refrigerants (TPTPR), Seoul Natl Univ, Seoul, SOUTH KOREA, apr 23-26, 2017
Note
Funding Agencies|National Research Foundation of Korea(NRF) - Korea government(MSIP) [NRF-2016R1D1A1B03932377]; Brain Korea 21 Plus program [21A20131712520]
2021-06-232021-06-232021-06-23