Microwave circuits in multilayer ORMOCER® thin film
2002 (English)In: Proceedings IMAPS Nordic 2002, 2002, 60-63 p.Conference paper (Other academic)
A multilayer sequential build-up structure for the integration of passivemicrowave devices is presented. The different devices were processed byusing a photo-patternable polymer ORMOCER together with conducting layersof Cu on top of a FR-4 substrate. Microstrip and stub structures have beencharacterised at frequencies between 1 to 40 GHZ showing the feasibility ofusing this kind of material and build-up technology for microwaveapplications.
Place, publisher, year, edition, pages
2002. 60-63 p.
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-13133OAI: oai:DiVA.org:liu-13133DiVA: diva2:17886
IMAPS Nordic 2002 Conference, Globe Hotel, Stockholm, Sweden, 29 September - 2 October 2002