Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates
2003 (English)In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 26, no 1, 81-89 p.Article in journal (Refereed) Published
Requirements of higher performance, reduced size, weight and cost of high-frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also of interest are integrated packaging solutions for high frequency electrical packaging and optical interconnects and packaging. Sequentially build up multi-layers have been deposited on a low cost FR-4 epoxy substrate. The dielectric layers consist of a photo-patternable inorganic-organic hybrid polymer (ORMOCER) and the metallization is Cu. An UV-exposure equipment enabling projection patterning with 5 μm resolution have been used. The produced microstrip lines, ring resonators, vias, stacked capacitors and filters have been characterized at frequencies from 1 to 40 GHz showing the potential of the new dielectric materials and processing technologies for microwave applications.
Place, publisher, year, edition, pages
2003. Vol. 26, no 1, 81-89 p.
High frequency electrical characterization, microwave circuits, multilayer thin film technology, ORMOCER
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-13134DOI: 10.1109/TADVP.2003.811548OAI: oai:DiVA.org:liu-13134DiVA: diva2:17887