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Sputtring av Ti-Si-C-Ag beläggningar från sammansatta sputterkällor
Linköping University, Department of Physics, Chemistry and Biology, Thin Film Physics.
2009 (Swedish)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesisAlternative title
Sputtering of Ti-Si-C-Ag coatings from compound sputter sources (English)
Abstract [sv]

Idag används guld som kontaktmaterial på elektriska kontakter för lågströmstillämpningar. Guldhar emellertid låg nötningsbeständighet, är dyrt och miljömässigt påfrestande att utvinna. Ettalternativt kontaktmaterial till guld är nanokomposit Ti-Si-C-Ag belagt medlikströmsmagnetronsputtring. Nanokomposit Ti-Si-C-Ag har hittills belagts med sammansatt Ti-Si-C sputterkälla och separat silverkälla.

I detta arbete har filmer belagts från tre olika sammansatta Ti-Si-C-Ag-källor med tre olikakolhalter. Filmerna har belagts i två olika beläggningssystem: Ett konventionellt batchladdat ochett sekventiellt med sluss.

Filmernas fas- och ämnessammansättning har studerats med XRD och EDX. Tjocklek ochmikrostruktur har analyserats med SEM. Vidhäftning och resistivitet har analyserats medRockwellindentation och ytresistansmätning med fyrpunktsprob. Kontaktresistansen har ävenstuderats i begränsad mån.

Arbetet visar att ökat kolinnehåll i källan ger kolrikare filmer med större titankarbidkorn.Resistiviteten ökar p.g.a. tilltagen amorf fas mellan kornen men kontaktresistansen sjunker givetduktilare film.

Abstract [en]

Today gold is used as contact material on electric contacts for low current applications. Gold, however,has low wear resistance, is expensive and environmentally stressful to produce. An alternative contactmaterial to gold is nano composite Ti-Si-C-Ag deposited with DC-magnetron sputtering. Nanocomposite Ti-Si-C-Ag has so far been deposited by a compound Ti-Si-C sputter source with a separateAg source.

In this work films have been deposited by three different compound Ti-Si-C-Ag sources with threedifferent carbon contents. The films have been deposited in two separate PVD systems: Oneconventional batch loaded and one sequential with a load-lock.

The phase- and elemental composition of the films has been studied with XRD and EDX respectively.Thickness and microstructure have been analysed with SEM. Adhesion and resistivity has beenanalysed with Rockwell indentation and surface resistivity measurement with four point probe. Contactresistance has also been studied to a limited extent.

The work shows that the increment of carbon content in the source yields more carbon rich films withlarger titanium carbide crystallites. The resistivity is increasing due to an increased amorphous phasebetween the crystallites but the contact resistance is decreasing due to a more ductile film.

Place, publisher, year, edition, pages
2009. , 51 p.
Keyword [en]
PVD, thin film physics, nanocomposite, electric contact, XRD, SEM, EDX
Keyword [sv]
PVD, tunnfilmsfysik, nanokomposit, elektrisk kontakt, XRD, SEM, EDX
National Category
Condensed Matter Physics
Identifiers
URN: urn:nbn:se:liu:diva-20045ISRN: LITH-IFM-A-EX--09/2053—SEOAI: oai:DiVA.org:liu-20045DiVA: diva2:232796
Presentation
2009-02-24, Jordan-Fermi, Campus Valla, Linköpings Universitet, Linköping, 10:15 (Swedish)
Uppsok
Physics, Chemistry, Mathematics
Supervisors
Examiners
Available from: 2009-08-28 Created: 2009-08-26 Last updated: 2009-08-28Bibliographically approved

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