Construction of wire electrodesand 3D woven logicas a potential technology forneuroprosthetic implants
2008 (English)In: IEEE Transactions on Biomedical Engineering, ISSN 0018-9294Article in journal (Other academic) Submitted
New strategies to improve neuron coupling to neuroelectronic implants are needed. In particular, tomaintain functional coupling between implant and neurons, foreign body response like encapsulation must meminimized. Apart from modifying materials to mitigate encapsulation it has been shown that with extremely thinstructures, encapsulation will be less pronounced. We here utilize wire electrochemical transistors (WECTs) usingconducting polymer coated fibers. Monofilaments down to 10 μm can be successfully coated and weaved intocomplex networks with built in logic functions, so called textile logic. Such systems can control signal patterns at alarge number of electrode terminals from a few addressing fibres. Not only is fibre size in the range where lessencapsulation is expected but textiles are known to make successful implants because of their soft and flexiblemechanical properties. Further, textile fabrication provides versatility and even three dimensional networks arepossible. Three possible architectures for neuroelectronic systems are discussed. WECTs are sensitive to dehydrationand materials for better durability or improved encapsulation is needed for stable performance in biologicalenvironments.
Place, publisher, year, edition, pages
Conducting polymers, functional electrical stimulation, textile electronics
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-20804OAI: oai:DiVA.org:liu-20804DiVA: diva2:236150