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Thermal analysis of an electronic module with a double-sided PCB housed in a 2-MCU enclosure for avionic applications
SaabTech AB.
School of Engineering, Jönköping University.
School of Engineering, Jönköping University.
Acreo, AB, Jönköping, Sweden.
2004 (English)In: 37th International Symposium on Microelectronics (IMAPS 2004): Everything in Electronics...Between the Chip and the System!, Curran Associates, Inc., 2004, 747-755 p.Conference paper, Published paper (Refereed)
Abstract [en]

Thermal analysis of an electronic module housed in a 2 Modular Concept Unit (MCU, ARINC 600 standard) enclosure used in a helicopter application has been performed by means of computational fluid dynamics (CFD). The case temperature of surface-mounted components on a folly populated multi-layer double sided PCB has been evaluated for total power levels ranging from 12 W to 60 W. A simulation procedure has been proposed in order to evaluate the maximum cooling effect of power re-distribution between the PCB sides at different total power levels and for different PCB configurations, given thermal constraints for the case temperature of surface-mounted componellls. As a result, thermal design guidelines for electronic modules with double-sided PCBs have been developed regarding preferable power distribution between the sides of the PCB.

Place, publisher, year, edition, pages
Curran Associates, Inc., 2004. 747-755 p.
Keyword [en]
thermal management, cfd, double-sided pcb, avionics
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-22720Local ID: 2023ISBN: 9781604234626 (print)OAI: oai:DiVA.org:liu-22720DiVA: diva2:243033
Conference
The 37th International Symposium on Microelectronics, IMAPS 2004, Long Beach, CA., 14-18 November 2004
Available from: 2009-10-07 Created: 2009-10-07 Last updated: 2013-11-12
In thesis
1. Thermal management of electronics in avionics applications
Open this publication in new window or tab >>Thermal management of electronics in avionics applications
2005 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

The development of electronic equipment towards minimizing of cost and size has lead to increased requirements on the cooling equipment for electronics. In avionics applications, constraints are put on all equipment regarding size, weight, and reliability. Additionally, harsh environmental stresses combined with relatively smallscale production reduces the possibilities for developing semiconductor components adapted for avionic use. In this thesis, an overview of current and upcoming challenges in thermal design of avionic equipment is given, followed by basic heat transfer theory, and a survey of state of the art in thermal management within avionics, thermal design tools, and reliability prediction.

The included papers focus on power distribution between the sides of a double-sided PCB as a thermal management measure. In the first paper, numerical simulation is used for evaluating the impact of power distribution on a double-sided PCB attached to the sidewall of a sealed enclosure. The enclosure is cooled by forced convection air passing along a finned heat sink tooled in the chassis wall. Paper 2 describes an experimental setup created for validating the results obtained in Paper 1. In Paper number 3, the effect of power distribution with non-uniform power configuration on the PCB sides is investigated by experimental measurements supported by simulations. In this paper, different cooling conditions, including forced convection directly on the PCB, are examined. In the article provided in Paper 4, an analytical description of the non-uniform power configuration can be found, as well as a numerical evaluation of the different power configurations discussed in Paper 3.

lt is concluded that communication between design engineers active in different spheres is a vital component for overcoming the thermal issues that are currently arising. Space must be provided in an early stage of product design phase for interdisciplinary thermal analysis and design. Furthermore, power distribution on a double-sided PCB is shown to be a thermal management measure without adding cost and weight to the electronic system. At moderate powers, maximum 36 W, and with equal power applied to all components on one side (uniform power configuration), this measure is confirmed to lower the maximum case temperature of the components by 4°C. Considering the more practical non-uniform power configuration, an even higher effect of power distribution can be achieved.

Place, publisher, year, edition, pages
Linköping: Linköpings universitet, 2005. 39 p.
Series
Linköping Studies in Science and Technology. Thesis, ISSN 0280-7971
Series
Linköping studies in science and technology. Thesis, 1177
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-28745 (URN)LiU-TEK-LIC-2005:32 (ISRN)13920 (Local ID)91-85299-77-4 (ISBN)13920 (Archive number)13920 (OAI)
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2016-12-22

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Johansson, Jonas

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