Thermal analysis of an electronic module with a double-sided PCB housed in a 2-MCU enclosure for avionic applications
2004 (English)In: 37th International Symposium on Microelectronics (IMAPS 2004): Everything in Electronics...Between the Chip and the System!, Curran Associates, Inc., 2004, 747-755 p.Conference paper (Refereed)
Thermal analysis of an electronic module housed in a 2 Modular Concept Unit (MCU, ARINC 600 standard) enclosure used in a helicopter application has been performed by means of computational fluid dynamics (CFD). The case temperature of surface-mounted components on a folly populated multi-layer double sided PCB has been evaluated for total power levels ranging from 12 W to 60 W. A simulation procedure has been proposed in order to evaluate the maximum cooling effect of power re-distribution between the PCB sides at different total power levels and for different PCB configurations, given thermal constraints for the case temperature of surface-mounted componellls. As a result, thermal design guidelines for electronic modules with double-sided PCBs have been developed regarding preferable power distribution between the sides of the PCB.
Place, publisher, year, edition, pages
Curran Associates, Inc., 2004. 747-755 p.
thermal management, cfd, double-sided pcb, avionics
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-22720Local ID: 2023ISBN: 9781604234626OAI: oai:DiVA.org:liu-22720DiVA: diva2:243033
The 37th International Symposium on Microelectronics, IMAPS 2004, Long Beach, CA., 14-18 November 2004