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Thermal management of electronics in avionics applications
Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
2005 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

The development of electronic equipment towards minimizing of cost and size has lead to increased requirements on the cooling equipment for electronics. In avionics applications, constraints are put on all equipment regarding size, weight, and reliability. Additionally, harsh environmental stresses combined with relatively smallscale production reduces the possibilities for developing semiconductor components adapted for avionic use. In this thesis, an overview of current and upcoming challenges in thermal design of avionic equipment is given, followed by basic heat transfer theory, and a survey of state of the art in thermal management within avionics, thermal design tools, and reliability prediction.

The included papers focus on power distribution between the sides of a double-sided PCB as a thermal management measure. In the first paper, numerical simulation is used for evaluating the impact of power distribution on a double-sided PCB attached to the sidewall of a sealed enclosure. The enclosure is cooled by forced convection air passing along a finned heat sink tooled in the chassis wall. Paper 2 describes an experimental setup created for validating the results obtained in Paper 1. In Paper number 3, the effect of power distribution with non-uniform power configuration on the PCB sides is investigated by experimental measurements supported by simulations. In this paper, different cooling conditions, including forced convection directly on the PCB, are examined. In the article provided in Paper 4, an analytical description of the non-uniform power configuration can be found, as well as a numerical evaluation of the different power configurations discussed in Paper 3.

lt is concluded that communication between design engineers active in different spheres is a vital component for overcoming the thermal issues that are currently arising. Space must be provided in an early stage of product design phase for interdisciplinary thermal analysis and design. Furthermore, power distribution on a double-sided PCB is shown to be a thermal management measure without adding cost and weight to the electronic system. At moderate powers, maximum 36 W, and with equal power applied to all components on one side (uniform power configuration), this measure is confirmed to lower the maximum case temperature of the components by 4°C. Considering the more practical non-uniform power configuration, an even higher effect of power distribution can be achieved.

Place, publisher, year, edition, pages
Linköping: Linköpings universitet , 2005. , 39 p.
Series
Linköping Studies in Science and Technology. Thesis, ISSN 0280-7971
Series
Linköping studies in science and technology. Thesis, 1177
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-28745ISRN: LiU-TEK-LIC-2005:32Local ID: 13920ISBN: 91-85299-77-4 (print)OAI: oai:DiVA.org:liu-28745DiVA: diva2:249557
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2016-12-22
List of papers
1. Thermal analysis of an electronic module with a double-sided PCB housed in a 2-MCU enclosure for avionic applications
Open this publication in new window or tab >>Thermal analysis of an electronic module with a double-sided PCB housed in a 2-MCU enclosure for avionic applications
2004 (English)In: 37th International Symposium on Microelectronics (IMAPS 2004): Everything in Electronics...Between the Chip and the System!, Curran Associates, Inc., 2004, 747-755 p.Conference paper, Published paper (Refereed)
Abstract [en]

Thermal analysis of an electronic module housed in a 2 Modular Concept Unit (MCU, ARINC 600 standard) enclosure used in a helicopter application has been performed by means of computational fluid dynamics (CFD). The case temperature of surface-mounted components on a folly populated multi-layer double sided PCB has been evaluated for total power levels ranging from 12 W to 60 W. A simulation procedure has been proposed in order to evaluate the maximum cooling effect of power re-distribution between the PCB sides at different total power levels and for different PCB configurations, given thermal constraints for the case temperature of surface-mounted componellls. As a result, thermal design guidelines for electronic modules with double-sided PCBs have been developed regarding preferable power distribution between the sides of the PCB.

Place, publisher, year, edition, pages
Curran Associates, Inc., 2004
Keyword
thermal management, cfd, double-sided pcb, avionics
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-22720 (URN)2023 (Local ID)9781604234626 (ISBN)2023 (Archive number)2023 (OAI)
Conference
The 37th International Symposium on Microelectronics, IMAPS 2004, Long Beach, CA., 14-18 November 2004
Available from: 2009-10-07 Created: 2009-10-07 Last updated: 2013-11-12
2. An experimental setup for validating a CFD model of a double-sided PCB in a sealed enclosure at various power configurations
Open this publication in new window or tab >>An experimental setup for validating a CFD model of a double-sided PCB in a sealed enclosure at various power configurations
2005 (English)In: Proceedings of EuroSime 2005, Berlin: EuroSime , 2005, 127-133 p.Conference paper, Published paper (Refereed)
Abstract [en]

A flexible experimental setup enabling power control of a fully populated double-sided PCB has been realized, and is described in detail. A CFD model of a double-sided PCB housed in a sealed enclosure has been validated in a 19°C environment by means of temperature and flow measurement. The difference between simulated and measured component temperatures has been within 10%. Potential errors both in the model and in the experiments have been discussed and their impact on temperatures has been numerically evaluated.

Place, publisher, year, edition, pages
Berlin: EuroSime, 2005
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-28747 (URN)10.1109/ESIME.2005.1502787 (DOI)13922 (Local ID)0-7803-9062-8 (ISBN)0-7803-9063-6 (ISBN)13922 (Archive number)13922 (OAI)
Conference
The 6th IEEE EuroSimE conference, April 18-20, Berlin, Germany
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2013-11-12Bibliographically approved
3. Investigating the effect of power distribution on cooling a double-sided PCB: Numerical simulation and experiment
Open this publication in new window or tab >>Investigating the effect of power distribution on cooling a double-sided PCB: Numerical simulation and experiment
2005 (English)In: Proceedings of ASME Summer Heat Transfer Conference 2005, San Fransisco: ASME , 2005, 649-657 p.Conference paper, Published paper (Refereed)
Abstract [en]

An experimental procedure for investigating the effect of power distribution on the cooling of a double-sided PCB is implemented. A number of computational fluid dynamics (CFD) models are validated by laboratory experiments performed in 19.5°C temperature environment. Case temperatures of surface-mounted components fully populating the PCB sides are measured and monitored in simulations. Different combinations of power distribution with other cooling methods, such as a heatsink tooled on a sealed or open enclosure, at natural or forced convection, are studied. Thermally efficient uniform and non-uniform power configurations are determined on a double sided PCB. It is concluded that managing power distribution on a double-sided PCB can be considered as a measure to improve the thermal performance of electronic modules.

Place, publisher, year, edition, pages
San Fransisco: ASME, 2005
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-28748 (URN)10.1115/HT2005-72549 (DOI)13923 (Local ID)0-7918-4734-9 (ISBN)0-7918-3762-9 (ISBN)13923 (Archive number)13923 (OAI)
Conference
ASME 2005 Summer Heat Transfer Conference collocated, with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, Heat Transfer: Volume 4, San Francisco, California, USA, July 17–22, 2005
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2013-11-12Bibliographically approved
4. CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB
Open this publication in new window or tab >>CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB
2007 (English)In: Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2007, IEEE , 2007, 233-243 p.Conference paper, Published paper (Refereed)
Abstract [en]

Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.

Place, publisher, year, edition, pages
IEEE, 2007
Series
Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221 ; 2007
Keyword
Avionics, thermal management, double-sided PCB, CFD, non-dominated designs
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:liu:diva-91902 (URN)10.1109/STHERM.2007.352429 (DOI)1-4244-09589-4 (print) (ISBN)1-4244-09589-4 (online) (ISBN)
Conference
23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007), March 18-22, San Jose, CA. USA
Note

At the time for thesis presentation publication was in status: Manuscript

Available from: 2013-05-04 Created: 2013-05-04 Last updated: 2016-12-22Bibliographically approved

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Johansson, Jonas

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