Investigating the effect of power distribution on cooling a double-sided PCB: Numerical simulation and experiment
2005 (English)In: Proceedings of ASME Summer Heat Transfer Conference 2005, San Fransisco: ASME , 2005, 649-657 p.Conference paper (Refereed)
An experimental procedure for investigating the effect of power distribution on the cooling of a double-sided PCB is implemented. A number of computational fluid dynamics (CFD) models are validated by laboratory experiments performed in 19.5°C temperature environment. Case temperatures of surface-mounted components fully populating the PCB sides are measured and monitored in simulations. Different combinations of power distribution with other cooling methods, such as a heatsink tooled on a sealed or open enclosure, at natural or forced convection, are studied. Thermally efficient uniform and non-uniform power configurations are determined on a double sided PCB. It is concluded that managing power distribution on a double-sided PCB can be considered as a measure to improve the thermal performance of electronic modules.
Place, publisher, year, edition, pages
San Fransisco: ASME , 2005. 649-657 p.
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-28748DOI: 10.1115/HT2005-72549Local ID: 13923ISBN: 0-7918-4734-9 (print)ISBN: 0-7918-3762-9 (online)OAI: oai:DiVA.org:liu-28748DiVA: diva2:249560
ASME 2005 Summer Heat Transfer Conference collocated, with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, Heat Transfer: Volume 4, San Francisco, California, USA, July 17–22, 2005