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Flexible cables for massive-parallel high-speed data communications
Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
2006 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

The demand for high-speed data communications has pushed both the wired and wireless technologies to operate at higher and higher frequencies. Classic Kirchhoffs voltage and current laws cannot be directly applied, when entering the microwave spectrum for frequency > 1 GHz. Instead, the transmission line theory should be used. Most of today's wired communication products use bit-serial cables to connect devices. To transfer massive data at high speed, parallel data transfer techniques can be utilized and the speed can be increased by the number of parallel lines or cables, if the transfer rate per line or cable can be maintained. However, the interference between the lines or cables must to be well-shielded so the crosstalk between them can be minimized.

Differential lines can also be used to increase the data speed further compared to the single-ended lines, along with saving the power consumption and reducing the electromagnetic interference. However, characterization for the differential lines is not as straight forward as that for the single-ended cases using standard S-parameters. Instead, mixed-mode S-parameters are needed to explain the differential-, common- and mixed-mode characteristics of the differential signal. The mixed-mode S-parameters were first introduced in 1995 and are now widely used. However, improvements of the theory can still be found to increase the accuracy of simulations and measurements.

This thesis presents a study of massive-parallel conductors on flexible cables. Furthermore, some connectors in combination with the flexible cable are studies for high-speed data transfer. The conversion method for mixed-mode Sparameters has been reviewed and a new method to improve the conversion accuracy has been proposed.

Place, publisher, year, edition, pages
Norrköping: Linköping University , 2006. , 40 p.
Series
Linköping Studies in Science and Technology. Thesis, ISSN 0280-7971 ; 1282
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-36192Local ID: 30467ISBN: 91-85643-44-0 (print)OAI: oai:DiVA.org:liu-36192DiVA: diva2:257040
Available from: 2009-10-10 Created: 2009-10-10 Last updated: 2013-12-19
List of papers
1. Study of high-speed data transfer utilizing flexible and parallel transmission lines
Open this publication in new window or tab >>Study of high-speed data transfer utilizing flexible and parallel transmission lines
2005 (English)In: Procedings of International Microelectronics and Packaging Society Nordic,, Pelkosen Painotuote in Kiiminki, Finland , 2005, 230-234 p.Conference paper, Published paper (Other academic)
Abstract [en]

Today many systems use serial data transfer techniques like serial AT attachment (SATA), Firewire and universal serial bus (USB). However, with parallel techniques the data transfer can be raised to a much higher speed. Having wires in parallel, one must also deal with phenomena such as crosstalk. To overcome crosstalk between parallel lines one must follow some design rules to avoid interference, like optimizing spaces between transmission lines. In this work simulations on high-speed single-ended and parallel channels utilizing microstrips and striplines have been done to show parameters that limit the channel bandwidth and thus the data rate. Design and simulations have been done using the Computer Aided Design (CAD) tool, Advanced Design System (ADS) provided by Agilent Technologies Inc. It is shown that both conductor surface roughness and dielectric loss will introduce extra AC noise to the signal. When having parallel conductors the AC noise increases with decreased rise/fall time, introduced by skin effect, conductor surface roughness and dielectric loss.

Place, publisher, year, edition, pages
Pelkosen Painotuote in Kiiminki, Finland, 2005
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-32317 (URN)18209 (Local ID)18209 (Archive number)18209 (OAI)
Conference
Procedings of International Microelectronics and Packaging Society Nordic, September, Törnsberg, Norway
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2013-12-19
2. High-speed parallel data transmission utilizing a flex-rigid concept
Open this publication in new window or tab >>High-speed parallel data transmission utilizing a flex-rigid concept
2005 (English)Conference paper, Published paper (Refereed)
Abstract [en]

Transmission lines utilizing microstrips on a flex-foil with low dielectric loss (tanδ = 0.002) have been simulated to compare with the transmission lines laminated with a rigid part, a so-called flex-rigid structure. At high speeds, even solders, pads and connectors affect the signal integrity because of their parasitic effects. The flex-rigid structure does not require these extra parts, resulting in good signal integrity and thus high data transfer rates. Another advantage with a flexible cable is that dense parallel microstrips can easily be designed. Although many wired data communications utilize serial techniques like Serial AT Attachment (SATA), Universal Serial Bus (USB) and Firewire, the serial data link has its limitations when very high data speeds are required. With a parallel data transmission technique, the data transfer rate can be raised to a very high speed. However, a parallel data transmission technique has some disadvantages such as crosstalk and skew between the signals which must be considered.

National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-32318 (URN)18210 (Local ID)18210 (Archive number)18210 (OAI)
Conference
Gigahertz 2005, 8-9 September, Uppsala, Sweden
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2013-12-19
3. High-Speed Board-to-Board Interconnects utilizing Flexible Foils and Elastomeric Connectors
Open this publication in new window or tab >>High-Speed Board-to-Board Interconnects utilizing Flexible Foils and Elastomeric Connectors
2006 (English)In: HDP'06. Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, IEEE , 2006, 157-160 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents a board-to-board interconnect technique utilizing elastomeric connectors and parallel microstrip lines on a flexible foil cable with low dielectric loss (tandelta = 0.002). It is shown that a pad structure combined with an elastomeric connector can be co-designed such that a good signal integrity and thus a high data transmission rate is achieved. It is also shown that 2 Gbps data transmission rate can be achieved with a 490-mm-long microstrip on the flexible cable, where crosstalk is taken into account. Utilizing the elastomeric connector together with the flat and flexible cable, dense parallel microstrips can easily be designed and processed since standard printed circuit board processing techniques can be utilized

Place, publisher, year, edition, pages
IEEE, 2006
Keyword
High-Speed Interconnects, Flexible cable, Elastomeric Connector
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-36189 (URN)10.1109/HDP.2006.1707585 (DOI)30446 (Local ID)1-4244-0488-6 (ISBN)30446 (Archive number)30446 (OAI)
Conference
The 8th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, June 27 – 28, Shanhai, China
Available from: 2009-10-10 Created: 2009-10-10 Last updated: 2013-12-19
4. Single-ended to Mixed-Mode S-Parameter Conversion for Networks with Coupled Differential Signaling
Open this publication in new window or tab >>Single-ended to Mixed-Mode S-Parameter Conversion for Networks with Coupled Differential Signaling
2007 (English)In: 36th European Microwave Conference, Munich: EUMC , 2007, 238-241 p.Conference paper, Published paper (Refereed)
Abstract [en]

It is shown in this paper that the commonly used method for converting from standard single-ended to mixed- mode S-parameters for networks with differential signaling only works for odd- and even-mode impedance equal to 50Omega. A correct conversion matrix equation must include the odd- and even-mode impedances which are not equal to the unique characteristic impedance owing to signal coupling in the network.

Place, publisher, year, edition, pages
Munich: EUMC, 2007
Keyword
Mixed-Mode S-Parameter Conversion, Coupled Differential Signaling
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-40870 (URN)10.1109/EUMC.2007.4405170 (DOI)54438 (Local ID)978-2-87487-001-9 (ISBN)54438 (Archive number)54438 (OAI)
Conference
36th European Microwave Conference, 10-15 September, Manchester, UK
Available from: 2009-10-10 Created: 2009-10-10 Last updated: 2013-12-19

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