New approach in depositing thick, layered cubic boron nitride coatings by oxygen addition-structural and compositional analysis
2006 (English)In: Thin solid films : an international journal on the science and technology of thin and thick films, Vol. 515, no 3, 1058-1062 p.Article in journal (Refereed) Published
Cubic boron nitride (c-BN) can be produced by PVD and PA-CVD techniques by intensive ion bombardment leading to highly stressed films limiting its use in industrial applications. Various attempts have been undertaken to reduce the compressive stress of c-BN thin films. A significant reduction in compressive stress and a substantially improved adhesion was achieved by a new coating concept consisting of a two-step adhesion-promoting base layer, a compositional-graded nucleation layer obtained by a stepwise decrease of the oxygen content in the Ar/N2/O2 atmosphere and a low-stressed c-BN:O top layer with controlled oxygen addition. The four-layer c-BN:O film with a thickness of 3 ìm was deposited by unbalanced radio frequency magnetron sputtering of a hot-pressed hexagonal boron nitride target on silicon substrates. The adhesion layer was deposited in a mixed Ar/O2 atmosphere of 0.26 Pa with a stepwise increased nitrogen gas flow and a subsequent increase of the ion energy by increasing the substrate bias from 0 to − 250 V. The c-BN nucleation was gradually initiated by decreasing the O2 gas flow. The present study was focused on the investigation of the morphology, the microstructure on the nanoscale, and the bonding structure using scanning electron microscopy (SEM), Fourier-Transmission infra-red spectroscopy (FTIR), high-resolution transmission electron microscopy (HRTEM) and electron energy loss spectroscopy (EELS) employing analytical scanning transmission electron microscopy (ASTEM). The HRTEM images revealed a four-layer coating consisting of a gradual nucleation of t-BN, on which a gradual nucleation of c-BN was achieved by decreasing the oxygen gas flow.
Place, publisher, year, edition, pages
2006. Vol. 515, no 3, 1058-1062 p.
Cubic boron nitride, Stress reduction, Adhesion, EELS, HRTEM
IdentifiersURN: urn:nbn:se:liu:diva-36760DOI: 10.1016/j.tsf.2006.07.069Local ID: 32446OAI: oai:DiVA.org:liu-36760DiVA: diva2:257609