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Electrical interconnects revitalized
Linköping University, The Institute of Technology. Linköping University, Department of Electrical Engineering, Electronic Devices.
2002 (English)In: IEEE Transactions on Very Large Scale Integration (vlsi) Systems, ISSN 1063-8210, E-ISSN 1557-9999, Vol. 10, no 6, p. 777-788Article in journal (Refereed) Published
Abstract [en]

Models of electrical interconnects, including inductance and skin effect, are reviewed. The models are used for estimating the performance of electrical interconnects, particularly related to delays, data rates, and power consumption for off-chip and on-chip interconnects and for clock distribution. It is demonstrated that correctly utilized, electrical interconnects do not severely limit chip or circuit board capacity. Delays, data rates, and power consumption of electrical interconnects within a circuit board are acceptable and superior to optical alternatives.

Place, publisher, year, edition, pages
2002. Vol. 10, no 6, p. 777-788
Keywords [en]
Chip wires, Circuit board wires, Data rate, Delay, Electrical interconnects, Optical interconnects, Power consumption
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-46817DOI: 10.1109/TVLSI.2002.801624OAI: oai:DiVA.org:liu-46817DiVA, id: diva2:267713
Available from: 2009-10-11 Created: 2009-10-11 Last updated: 2017-12-13

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Svensson, Christer

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