Microstructure in electrodeposited copper layers, the role of the substrate
2001 (English)In: Electrochimica Acta, ISSN 0013-4686, Vol. 47, no 1, 67-74 p.Article in journal (Refereed) Published
The microstructures of Cu layers, ranging in thickness from 3 to 12 µm, were investigated. The layers were electrodeposited from an acidic copper electrolyte onto two distinct substrate materials important for the micro-components industry: an Au layer with a pronounced <111>-texture, and a nano-crystalline Ni-P layer. The evolutions of surface topography, morphology and crystallographic texture in the layers were investigated with scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction analysis, respectively. Distinct surface topographies were observed for Cu layers deposited on the Au and Ni-P substrates. Deposition onto the Au substrate resulted in a very smooth surface of all Cu layers, whereas the Ni-P substrate caused an irregular surface for 3-µm-thick layers of Cu. The crystallographic texture in the Cu layers in the first few micrometres depended strongly on the crystallographic texture in the substrate. The Cu crystallites inherited the <111>-orientation of the Au substrate, whilst no preferred crystallographic orientation was observed in the Cu crystallites on the nano-crystalline Ni-P substrate. For Cu layers thicker than 3 µm a <110>-fibre texture developed on both the substrates. © 2001 Elsevier Science Ltd. All rights reserved.
Place, publisher, year, edition, pages
2001. Vol. 47, no 1, 67-74 p.
Copper plating, Electrodeposition, Microstructures, Textures
IdentifiersURN: urn:nbn:se:liu:diva-47275DOI: 10.1016/S0013-4686(01)00583-7OAI: oai:DiVA.org:liu-47275DiVA: diva2:268171