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Thermal stability of nitride thin films
Linköping University, The Institute of Technology. Linköping University, Department of Physics, Chemistry and Biology, Thin Film Physics.ORCID iD: 0000-0002-2837-3656
2000 (English)In: Vacuum, ISSN 0042-207X, Vol. 57, no 1Article, review/survey (Refereed) Published
Abstract [en]

This paper is a review of the thermal stability of state-of-the-art transition metal nitride thin films synthesized by physical vapour deposition techniques. Nitrides are successfully applied as wear-protection coatings for tools and mechanical components, decorative coatings, electrical contacts, and diffusion barriers in electronic devices. The aspects for thermal stability are on phase equilibrium, metal, nitrogen and impurity diffusion, recrystallization, phase separation, interfacial reactions, and oxidation. Microstructurally engineered structures are considered including single-crystals, nanolaminates, metastable alloys, and films in a state of compressive intrinsic stress. Titanium nitride is discussed in detail as a model system for the studies, but results are given also for NbN, AlN, BN, CNx, CrN, TiN-TiB2, Ti(C,N), and (Ti,Al)N films. More than 150 references are included. (C) 2000 Elsevier Science Ltd. All rights reserved.

Place, publisher, year, edition, pages
2000. Vol. 57, no 1
National Category
Engineering and Technology
URN: urn:nbn:se:liu:diva-49709OAI: diva2:270605
Available from: 2009-10-11 Created: 2009-10-11 Last updated: 2016-08-31

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