liu.seSearch for publications in DiVA
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Polymer optical interconnects - A scalable large-area panel processing approach
Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
Fröhlich, L., Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
Show others and affiliations
2006 (English)In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 29, no 1, p. 158-170Article in journal (Refereed) Published
Abstract [en]

A flexible approach to producing optical interconnects on 609.6 * 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 * 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6 * 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: = 50 µm * 10 µm) with refractive index step between core and cladding ?n = 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability. © 2006 IEEE.

Place, publisher, year, edition, pages
2006. Vol. 29, no 1, p. 158-170
Keywords [en]
Flexible manufacturing approach, Hybrid polymers, Large-area processing, Optical backplane, Optical interconnect review, ORMOCER, Polymer optical waveguide, Projection UV lithogaphy
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-50305DOI: 10.1109/TADVP.2005.849555OAI: oai:DiVA.org:liu-50305DiVA, id: diva2:271201
Available from: 2009-10-11 Created: 2009-10-11 Last updated: 2017-12-12

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full text

Authority records

Uhlig, SteffenChen, MiaoxiangRobertsson, Mats

Search in DiVA

By author/editor
Uhlig, SteffenChen, MiaoxiangRobertsson, Mats
By organisation
The Institute of TechnologyDepartment of Science and Technology
In the same journal
IEEE Transactions on Advanced Packaging
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 117 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf