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Residual stress gradient analysis by the GIXRD method on CVD tantalum thin films
LM3 UMR 8006, ENSAM, 151 bld. de l'Hopital, 75013 Paris, France.
LM3 UMR 8006, ENSAM, 151 bld. de l'Hopital, 75013 Paris, France.
LM3 UMR 8006, ENSAM, 151 bld. de l'Hopital, 75013 Paris, France.
Linköping University, Department of Management and Engineering, Engineering Materials. Linköping University, The Institute of Technology.
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2006 (English)In: Surface & Coatings Technology, ISSN 0257-8972, E-ISSN 1879-3347, Vol. 200, no 8, 2738-2743 p.Article in journal (Refereed) Published
Abstract [en]

Tantalum thin films have been preferred in case of corrosion protection in the chemical industry in high temperature applications because of their long lifetime. Residual stresses could be generated during thin film deposition and have some important influence on the film properties in use. The residual stress gradient and distribution should be correctly determined. Pseudo-grazing incidence X-ray diffraction (GIXRD) can be used to evaluate the residual stress gradient. A modified method sin2?* has been developed for GIXRD stress analysis with the calculation of geometry adapted real angles ?*. This method allows more practically determination of stress gradients near the surface in specific directions. The developed new technique was applied on three tantalum thin film specimens with different thicknesses (from 0.55 to 2.55 µm) obtained with a CVD process. © 2005 Elsevier B.V. All rights reserved.

Place, publisher, year, edition, pages
Elsevier, 2006. Vol. 200, no 8, 2738-2743 p.
Keyword [en]
CVD, Grazing incidence X-ray diffraction (GIXRD), Residual stress gradient, Tantalum, Thin films
National Category
Natural Sciences
URN: urn:nbn:se:liu:diva-50311DOI: 10.1016/j.surfcoat.2004.12.018ISI: 000235202100020OAI: diva2:271207
Available from: 2009-10-11 Created: 2009-10-11 Last updated: 2012-08-23

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