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X-ray diffraction investigation of electrochemically deposited copper
Technical University of Denmark.
Linköping University, Department of Physics, Chemistry and Biology. Linköping University, The Institute of Technology.
Technical University of Denmark.
2004 (English)In: Materials Science Forum, ISSN 0255-5476, E-ISSN 1662-9752, Vol. 443-4, 201-204 p.Article in journal (Refereed) Published
Abstract [en]

Copper layers were deposited from acidic electrolytes containing different amounts of organic additives, designed for the formation of Cu-interconnect structures. Amorphous Ni-P substrates allow to study the unbiased growth of the electrodeposits. The crystallographic texture was investigated by the determination of X-ray diffraction (XRD) pole figures and the calculation of the orientation distribution functions. XRD results are discussed in relation to the morphologies of the electrodeposits as investigated with light optical microscopy and correlated with the process parameters during electrodeposition.

Place, publisher, year, edition, pages
2004. Vol. 443-4, 201-204 p.
Keyword [en]
copper; electrodeposition; texture; thin films; X-ray diffraction
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-53533DOI: 10.4028/www.scientific.net/MSF.443-444.201OAI: oai:DiVA.org:liu-53533DiVA: diva2:289519
Available from: 2010-01-25 Created: 2010-01-25 Last updated: 2017-12-12

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Jensen, Jens

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