X-ray diffraction investigation of electrochemically deposited copper
2004 (English)In: Materials Science Forum, ISSN 0255-5476, Vol. 443-4, 201-204 p.Article in journal (Refereed) Published
Copper layers were deposited from acidic electrolytes containing different amounts of organic additives, designed for the formation of Cu-interconnect structures. Amorphous Ni-P substrates allow to study the unbiased growth of the electrodeposits. The crystallographic texture was investigated by the determination of X-ray diffraction (XRD) pole figures and the calculation of the orientation distribution functions. XRD results are discussed in relation to the morphologies of the electrodeposits as investigated with light optical microscopy and correlated with the process parameters during electrodeposition.
Place, publisher, year, edition, pages
2004. Vol. 443-4, 201-204 p.
copper; electrodeposition; texture; thin films; X-ray diffraction
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-53533DOI: 10.4028/www.scientific.net/MSF.443-444.201OAI: oai:DiVA.org:liu-53533DiVA: diva2:289519