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High-performance and low-power challenges for sub-70nm microprocessor circuits
Intel Corporation, Hillsboro, USA.
Linköping University, Department of Electrical Engineering, Electronic Devices. Linköping University, The Institute of Technology.
Intel Corporation, Hillsboro, USA.
Intel Corporation, Hillsboro, USA.
2002 (English)In: Proceedings of the IEEE Custom Integrated Circuits Conference, 2002, 125-128 p.Conference paper, Published paper (Refereed)
Abstract [en]

CMOS technology scaling is becoming difficult beyond 70nm node, raising new design challenges for highperformance and low-power microprocessors. This paper discusses some of the key paradigm shifts required. Circuit techniques to combat (i) increasing switching and leakage power dissipation, (ii) poor leakage tolerance of large-signal cache arrays and register files, and (iii) worsening global on-chip interconnect scaling trend, are described.

Place, publisher, year, edition, pages
2002. 125-128 p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-54008OAI: oai:DiVA.org:liu-54008DiVA: diva2:296808
Conference
IEEE Custom Integrated Circuits Conference
Available from: 2010-02-18 Created: 2010-02-18 Last updated: 2010-03-23

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Alvandpour, Atila

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