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Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, The Institute of Technology.
Indian Institute of Science, Bangalore, India.
2009 (English)In: DATE 2009 Friday Workshop on 3D Integration - Technology, Architecture, Design, Automation, and Test, Nice, France, April 20-24, 2009., 2009Conference paper (Refereed)
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Engineering and Technology
URN: urn:nbn:se:liu:diva-59593OAI: diva2:352615
Available from: 2010-09-21 Created: 2010-09-21 Last updated: 2010-09-30

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Larsson, Erik
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ESLAB - Embedded Systems LaboratoryThe Institute of Technology
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