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Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory. Linköping University, The Institute of Technology.
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2010 (English)In: IEEE East-West Design & Test Symposium (EWDTS10), St. Petersburg, Russia, September 17-20, 2010., IEEE , 2010, 343-349 p.Conference paper, Published paper (Refereed)
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IEEE , 2010. 343-349 p.
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Engineering and Technology
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URN: urn:nbn:se:liu:diva-59595DOI: 10.1109/EWDTS.2010.5742053ISBN: 978-1-4244-9555-9 (print)OAI: oai:DiVA.org:liu-59595DiVA: diva2:352617
Available from: 2010-09-21 Created: 2010-09-21 Last updated: 2013-09-17

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Larsson, Erik

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ESLAB - Embedded Systems LaboratoryThe Institute of Technology
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CiteExportLink to record
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  • apa
  • harvard1
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  • modern-language-association-8th-edition
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