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Analysis of residual stress development during thermal processing of Al-Si alloys
Linköping University, Department of Management and Engineering, Engineering Materials. Linköping University, The Institute of Technology.
Linköping University, Department of Management and Engineering, Engineering Materials. Linköping University, The Institute of Technology.
Linköping University, Department of Management and Engineering, Engineering Materials. Linköping University, The Institute of Technology.
2010 (English)Conference paper, Published paper (Refereed)
Abstract [en]

Residuals stresses can be present in almost every industrial component. Manufacturing processes such as casting, welding, and heat treatment are the most common causes of residual stresses. Thermal residual stresses could be developed in a component during heat treatment process as a result of non-uniform heating or cooling operations. In this study, experiments were carried out to develop insights into and understanding of the residual stresses that can arise during thermal treatments of Al-Si components. Due to the complexity of residual stresses analysis in real components, a common mixed-section casting was employed. In order to fulfill the requirements of performing different thermal treatments, a special cooling apparatus was designed and built. A number of the casting components of an Al-Si alloy were annealed for stress relief, and then removed from the furnace and cooled with different water flow rates. Then, the amount of accumulated residual stresses in the components was measured relaxation of stress using cutting. Thermal analysis and residual stress measurement for different thermal treatment regimes showed that by choosing a specific holding temperature before direct cooling, the value of residual stress increases linearly with flow rate of cooling. On the other hand, for a constant value of cooling water flow, ∆Tmax and residual stress level decreases when the value of base temperature of furnace decreases. Moreover, the cutting method can be a suitable method for measuring thermal residual stresses in Al-Si components and thermal analysis is a powerful technique to predict residual stresses.

Place, publisher, year, edition, pages
2010. 358-363 p.
Series
Materials Science Forum, ISSN 0255-5476 ; 681
National Category
Engineering and Technology Other Materials Engineering
Identifiers
URN: urn:nbn:se:liu:diva-60912DOI: 10.4028/www.scientific.net/MSF.681.358ISBN: 978-303785085-5 (print)OAI: oai:DiVA.org:liu-60912DiVA: diva2:359721
Conference
The 8th European Conference on Residual Stresses, Riva Del Garda, Italy
Available from: 2010-10-29 Created: 2010-10-29 Last updated: 2014-10-22

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Sadrossadat, MohsenPeng, RuJohansson, Sten

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
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  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
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Output format
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  • asciidoc
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