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Microstructure evolution of Ti-Si-C-Ag nanocomposite coatings deposited by DC magnetron sputtering
Linköping University, Department of Physics, Chemistry and Biology, Thin Film Physics. Linköping University, The Institute of Technology.
Linköping University, Department of Physics, Chemistry and Biology, Thin Film Physics. Linköping University, The Institute of Technology.ORCID iD: 0000-0003-1785-0864
Linköping University, Department of Physics, Chemistry and Biology, Thin Film Physics. Linköping University, The Institute of Technology.
Impact Coatings AB.
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2010 (English)In: Acta Materialia, ISSN 1359-6454, E-ISSN 1873-2453, Vol. 58, no 20, 6592-6599 p.Article in journal (Refereed) Published
Abstract [en]

Nanocomposite coatings consisting of Ag and TiCx (x andlt; 1) crystallites in a matrix of amorphous SiC were deposited by high-rate magnetron sputtering from Ti-Si-C-Ag compound targets. Different target compositions were used to achieve coatings with a Si content of similar to 13 at.%, while varying the C/Ti ratio and Ag content. Electron microscopy, helium ion microscopy, X-ray photoelectron spectroscopy and X-ray diffraction were employed to trace Ag segregation during deposition and possible decomposition of amorphous SiC. Eutectic interaction between Ag and Si is observed, and the Ag forms threading grains which coarsen with increased coating thickness. The coatings can be tailored for conductivity horizontally or vertically by controlling the shape and distribution of the Ag precipitates. Coatings were fabricated with hardness in the range 10-18 GPa and resistivity in the range 77-142 mu Omega cm.

Place, publisher, year, edition, pages
Elsevier Science B.V., Amsterdam. , 2010. Vol. 58, no 20, 6592-6599 p.
Keyword [en]
Nanocomposite, Analytical electron microscopy, Helium ion microscopy, X-ray photoelectron spectroscopy, Eutectic solidification
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-63405DOI: 10.1016/j.actamat.2010.08.018ISI: 000284446500004OAI: oai:DiVA.org:liu-63405DiVA: diva2:379120
Note
Original Publication: Jonas Lauridsen, Per Eklund, Jens Jensen, H Ljungcrantz, A Oberg, E Lewin, U Jansson, A Flink, H Hogberg and Lars Hultman, Microstructure evolution of Ti-Si-C-Ag nanocomposite coatings deposited by DC magnetron sputtering, 2010, ACTA MATERIALIA, (58), 20, 6592-6599. http://dx.doi.org/10.1016/j.actamat.2010.08.018 Copyright: Elsevier Science B.V., Amsterdam. http://www.elsevier.com/ Available from: 2010-12-17 Created: 2010-12-17 Last updated: 2017-12-11Bibliographically approved
In thesis
1. TiC-based nanocomposite coatings as electrical contacts
Open this publication in new window or tab >>TiC-based nanocomposite coatings as electrical contacts
2011 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This Thesis concerns the advanced surface engineering of novel TiC-based nanocomposite and AgI electrical contact materials. The objective is to make industrially applicable coatings that are electrically conductive and wear-resistant, and have a low coefficient of friction. I have studied electrical contact systems consisting of a Cu substrate with a Ni diffusion barrier and loading support, and a conductive top coating. The contact systems were characterized by x-ray diffraction and photoelectron spectroscopy, analytical electron microscopy, ion beam analysis, nanoindentation, resistivity, and contact resistance measurements. Nc-TiC/a-C/SiC nanocomposite coatings consisting of nanocrystalline (nc) TiC embedded in an amorphous (a) matrix of C/SiC were deposited by magnetron sputtering with rates as high as 16 μm/h. These coatings have a contact resistance comparable with Ag at high loads (~800 N) and a resistivity of 160-770 μΩcm. The electrical properties of the contact can be improved by adding Ag to make nc-Ag/nc-TiC/a-SiC nanocomposites. It is possible to tailor the size and distribution of the Ag grains by varying the fraction of amorphous matrix, so as to achieve good conductivity in all directions in the coatings. Ti-Si-C-Ag coatings have a contact resistance that is one magnitude larger than Ag at lower loads (~1 N), and a resistivity of 77-142 μΩcm. The conductivity of the matrix phase can be increased by substituting Ge, Sn or Cu for Si, which also reduces the Ag grain growth. This yields coatings with a contact resistance twice as high as Ag at loads of 1 N, and a resistivity 274-1013 μΩcm. The application of a conductive top layer of Ag-Pd upon a Ti-Si-C-Ag:Pd coating can further reduce the contact resistance. For barrier materials against Cu interdiffusion, it is shown that conventional electroplating of Ni can be replaced with sputtering of Ni or Ti layers. This is an advantage since both contact and barrier layers can now be deposited in and by the same deposition process. For Ti-B-C coatings deposited by magnetron sputtering, I demonstrate promising electrical properties in a materials system otherwise known for its good mechanical properties. In coatings of low B concentration, the B is incorporated into the TiC phase, probably by enrichment on the TiC{111} planes. The corresponding disturbance of the cubic symmetry results in a rhombohedral TiC:B structure. Finally, it is shown that AgI coatings consisting of weakly agglomerated AgI grains function as solid lubricant on Ag contacts. In an Ag sliding electrical contact, AgI decreases the friction coefficient from ~1.2 to ~0.4. After a few hundred operations, AgI grains have deagglomerated and Ag from the underlying layer is exposed on the surface and the contact resistance decreases to < 100 μΩ.

Place, publisher, year, edition, pages
Linköping: Linköping University Electronic Press, 2011. 63 p.
Series
Linköping Studies in Science and Technology. Dissertations, ISSN 0345-7524 ; 1408
National Category
Natural Sciences
Identifiers
urn:nbn:se:liu:diva-72228 (URN)978-91-7393-030-7 (ISBN)
Public defence
2011-12-02, Planck, Fysikhuset, Campus Valla, Linköpings universitet, Linköping, 10:15 (English)
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Available from: 2011-11-23 Created: 2011-11-23 Last updated: 2016-08-31Bibliographically approved

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Lauridsen, JonasEklund, PerJensen, JensHultman, Lars

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