Ni and Ti diffusion barrier layers between Ti-Si-C-Ag nanocomposite coatings and Cu-based substrates
2012 (English)In: Surface & Coatings Technology, ISSN 0257-8972, E-ISSN 1879-3347, Vol. 206, no 8-9, 2558-2565 p.Article in journal (Refereed) Published
Sputtered Ni and Ti layers were investigated as substitutes for electroplated Ni as adiffusion barrier between Ti-Si-C and Ti-Si-C-Ag nanocomposite coatings and Cu orCuSn substrates. Samples were subjected to thermal annealing studies by exposure to400 ºC during 11 h. Dense diffusion barrier and coating hindered Cu from diffusing tothe surface. This condition was achieved for electroplated Ni in combination withmagnetron-sputtered Ti-Si-C and Ti-Si-C-Ag layers deposited at 230 ºC and 300 ºC,and sputtered Ti or Ni layers in combination with Ti-Si-C-Ag deposited at 300 ºC.
Place, publisher, year, edition, pages
Elsevier, 2012. Vol. 206, no 8-9, 2558-2565 p.
Titanium carbide; nanocomposite; physical vapor deposition (PVD); diffusion; barrier; annealing
IdentifiersURN: urn:nbn:se:liu:diva-63624DOI: 10.1016/j.surfcoat.2011.11.014ISI: 000300458500069OAI: oai:DiVA.org:liu-63624DiVA: diva2:381745
funding agencies|The European EraSME Program||Swedish Knowledge Foundation||The Swedish Board for Innovation Systems VINN Excellence Center on Functional Nanostructured Materials (FunMat)||2010-12-282010-12-282016-08-31Bibliographically approved