Measurement Point Selection for In-Operation Wear-Out Monitoring
2011 (English)In: 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11), Cottbus, Germany, April 13-15, 2011., IEEE , 2011, 381-386 p.Conference paper (Refereed)
In recent IC designs, the risk of early failure due to electromigration wear-out has increased due to reduced feature dimensions. To give a warning of impending failure, wearout monitoring approaches have included delay measurement circuitry on-chip. Due to the high cost of delay measurement circuitry this paper presents a method to reduce the number of necessary measurement points. The proposed method is based on identification of wear-out sensitive interconnects and selects a small number of measurement points that can be used to observe the state of all the wear-out sensitive interconnects. The method is demonstrated on ISCAS85 benchmark ICs with encouraging results.
Place, publisher, year, edition, pages
IEEE , 2011. 381-386 p.
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-66349DOI: 10.1109/DDECS.2011.5783115ISBN: 978-1-4244-9755-3OAI: oai:DiVA.org:liu-66349DiVA: diva2:403343
14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2011; Cottbus; Germany