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Cost Reduction of Wear-Out Monitoring by Measurement Point Selection
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory.
Linköping University, Department of Computer and Information Science, ESLAB - Embedded Systems Laboratory.
2011 (English)In: The 11th Swedish System-on-Chip Conference, Varberg, Sweden, May 2-3, 2011, 2011Conference paper, Published paper (Other academic)
Abstract [en]

Early failure rates have increased due to reduced feature dimensions and electromigration wear-out. Periodic delay measurements can be employed to estimate the state of wear-out. Including delay measurement sensors on-chip is costly. Therefore, a method is proposed to reduce the number of measurement points. The method identi?es wear-out sensitive interconnects and selects a small number of measurement points to target the identi?ed interconnects. The method is demonstrated on ISCAS85 benchmark ICs.

Place, publisher, year, edition, pages
2011.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-69724OAI: oai:DiVA.org:liu-69724DiVA: diva2:432214
Available from: 2011-08-01 Created: 2011-08-01

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ESLAB - Embedded Systems Laboratory
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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
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  • sv-SE
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Output format
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  • asciidoc
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