Cost Reduction of Wear-Out Monitoring by Measurement Point Selection
2011 (English)In: The 11th Swedish System-on-Chip Conference, Varberg, Sweden, May 2-3, 2011, 2011Conference paper (Other academic)
Early failure rates have increased due to reduced feature dimensions and electromigration wear-out. Periodic delay measurements can be employed to estimate the state of wear-out. Including delay measurement sensors on-chip is costly. Therefore, a method is proposed to reduce the number of measurement points. The method identi?es wear-out sensitive interconnects and selects a small number of measurement points to target the identi?ed interconnects. The method is demonstrated on ISCAS85 benchmark ICs.
Place, publisher, year, edition, pages
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-69724OAI: oai:DiVA.org:liu-69724DiVA: diva2:432214