Prognostics of Thermal Fatigue Failure of Solder Joints in Avionic Equipment
2012 (English)In: IEEE Aerospace and Electronic Systems Magazine, ISSN 0885-8985, E-ISSN 1557-959X, Vol. 27, no 4, 16-24 p.Article in journal (Refereed) Published
A practical method has been suggested for solder joint thermal fatigue prognostics, which enables real-time fatigue calculations based on uncompressed temperature data embedded in a host system that performs safety-critical operations. The accuracy of the prognosticated remaining useful life depends on the level of details captured in the model, and the level of confidence from validation efforts.
Place, publisher, year, edition, pages
IEEE , 2012. Vol. 27, no 4, 16-24 p.
Thermal fatigue prognostics, physics-of-failure, electronics, avionics, solder joints.
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:liu:diva-91900DOI: 10.1109/MAES.2012.6203714OAI: oai:DiVA.org:liu-91900DiVA: diva2:619545