An approach to life consumption monitoring of solder joints in operating temperature environment
2012 (English)In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012, IEEE , 2012, 1-8 p.Conference paper (Refereed)
This paper elaborates the 3T-approach to life consumption monitoring of solder joints in operating temperature environment without requiring simplification of operating loads.
An overview of the 3T-approach is provided including assumptions made for a proposed realization in an avionic application. Associated implementation routines are highlighted and exemplified for a lead-free PBGA256 package with creep strain energy density (SEDcr) as damage metric.
Factors that affect the prediction accuracy are investigated. A data resolution has been determined that delivers response surfaces that provide results comparable to 3-D finite-element (FE) simulations, while bearing two orders of magnitude higher computational efficiency.
A stress-free temperature modification routine is proposed and proves to further mitigate accuracy problems.
Place, publisher, year, edition, pages
IEEE , 2012. 1-8 p.
Life consumption monitoring, solder joints, avionics, thermal fatigue
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:liu:diva-91901DOI: 10.1109/ESimE.2012.6191699ISBN: 978-1-4673-1512-8 (print)OAI: oai:DiVA.org:liu-91901DiVA: diva2:619547
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012), April 16-18, Cascais, Portugal