liu.seSearch for publications in DiVA
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB
Saab AB/Saab Avitronics, Jönköping, Sweden.
School of Engineering, Jönköping University, Jönköping, Sweden.
School of Engineering, Jönköping University, Jönköping, Sweden.
2007 (English)In: Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2007, IEEE , 2007, 233-243 p.Conference paper, Published paper (Refereed)
Abstract [en]

Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.

Place, publisher, year, edition, pages
IEEE , 2007. 233-243 p.
Series
Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221 ; 2007
Keyword [en]
Avionics, thermal management, double-sided PCB, CFD, non-dominated designs
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:liu:diva-91902DOI: 10.1109/STHERM.2007.352429ISBN: 1-4244-09589-4 (print) (print)ISBN: 1-4244-09589-4 (online) (print)OAI: oai:DiVA.org:liu-91902DiVA: diva2:619549
Conference
23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007), March 18-22, San Jose, CA. USA
Note

At the time for thesis presentation publication was in status: Manuscript

Available from: 2013-05-04 Created: 2013-05-04 Last updated: 2016-12-22Bibliographically approved
In thesis
1. Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: A Contribution to Physics of Failure in Reliability Prediction
Open this publication in new window or tab >>Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling: A Contribution to Physics of Failure in Reliability Prediction
2013 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. As an effect, controlling the temperature of electronic components is central in electronic product development in order to maintain and potentially improve the reliability of the equipment. Simultaneously, the transition to lead-free electronic equipment will most probably propagate also to the ADHP industry. Compared to well-proven tin-lead solder, the knowledge about field operation reliability of lead-free solders is still limited, as well as the availability of damage evaluation models validated for field temperature conditions. Hence, the need to fill in several knowledge gaps related to reliability and reliability prediction of lead-free solder alloys is emphasized. Having perceived increasing problems experienced in the reliability of fielded equipment, the ADHP industry has suggested inclusion of physics-of-failure (PoF) in reliability prediction of electronics as one potential measure to improve the reliability of the electronic systems.

This thesis aims to contribute to the development of reliable ADHP systems, with the main focus on electronic equipment for the aerospace industry. In order to accomplish this, the thesis provides design guidelines for power distribution on a double-sided printed circuit board assembly (PBA) as a measure to improve the thermal performance without increasing the weight of the system, and a novel, computationally efficient method for PoF-based evaluation of damage accumulation in solder joints in harsh, non-cyclic field operation temperature environments.

Thermal fatigue failure mechanisms and state‑of‑the‑art thermal design and design tools are presented, with focus on the requirements that may arise from avionic use, such as low weight, high reliability, and ability to sustain functional during high vibration levels and high g-forces. Paper I, II, and III describes an in-depth investigation that has been performed utilizing advanced thermal modeling of power distribution on a double-sided PBA as a measure to improve the thermal performance of electronic modules.

Paper IV contributes to increasing the accuracy of thermal fatigue life prediction in solder joints, by employing existing analytical models for predicting thermal fatigue life, but enhancing the prediction result by incorporating advanced thermal analysis in the procedure.

Papers V and VI suggest and elaborate on a computational method that utilizes surrogate stress and strain modeling of a solder joint, to quickly evaluate the damage accumulated in a critical solder joint from non-cyclic, non-simplified field operation temperature profiles, with accuracy comparable to finite element modeling. The method has been tested on a ball grid array package with SnAgCu solder joints. This package is included in an extensive set of accelerated tests that helps to qualify certain packages and solder alloys for avionic use. The tests include -20°C to +80°C and -55°C to +125°C thermal cycling of a statistically sound population of a number of selected packages, assembled with SnAgCu, Sn100C, and SnPbAg solder alloys. Statistical analysis of the results confirms that the SnAgCu-alloy may outperform SnPbAg solder at moderate thermal loads on the solder joints.

In Papers VII and VIII, the timeframe is extended to a future, in which validated life prediction models will be available, and the suggested method is expected to increase the accuracy of embedded prognostics of remaining useful thermal fatigue life of a critical solder joint.

The key contribution of the thesis is the added value of the proposed computational method utilized in the design phase for electronic equipment. Due to its ability for time-efficient operation on uncompressed temperature data, the method gives contribution to the accuracy, and thereby also to the credibility, of reliability prediction of electronic packages in the design phase. This especially relates to applications where thermal fatigue is a dominant contributor to the damage of solder joints.

Place, publisher, year, edition, pages
Linköping: Linköping University Electronic Press, 2013. 64 p.
Series
Linköping Studies in Science and Technology. Dissertations, ISSN 0345-7524 ; 1521
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:liu:diva-91903 (URN)978-91-7519-618-3 (ISBN)
Public defence
2013-06-11, K3, Kåkenhus, Campus Norrköping, Linköpings Universitet, Norrköping, 10:15 (English)
Opponent
Supervisors
Funder
The Knowledge Foundation
Available from: 2013-05-08 Created: 2013-05-04 Last updated: 2013-05-08Bibliographically approved
2. Thermal management of electronics in avionics applications
Open this publication in new window or tab >>Thermal management of electronics in avionics applications
2005 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

The development of electronic equipment towards minimizing of cost and size has lead to increased requirements on the cooling equipment for electronics. In avionics applications, constraints are put on all equipment regarding size, weight, and reliability. Additionally, harsh environmental stresses combined with relatively smallscale production reduces the possibilities for developing semiconductor components adapted for avionic use. In this thesis, an overview of current and upcoming challenges in thermal design of avionic equipment is given, followed by basic heat transfer theory, and a survey of state of the art in thermal management within avionics, thermal design tools, and reliability prediction.

The included papers focus on power distribution between the sides of a double-sided PCB as a thermal management measure. In the first paper, numerical simulation is used for evaluating the impact of power distribution on a double-sided PCB attached to the sidewall of a sealed enclosure. The enclosure is cooled by forced convection air passing along a finned heat sink tooled in the chassis wall. Paper 2 describes an experimental setup created for validating the results obtained in Paper 1. In Paper number 3, the effect of power distribution with non-uniform power configuration on the PCB sides is investigated by experimental measurements supported by simulations. In this paper, different cooling conditions, including forced convection directly on the PCB, are examined. In the article provided in Paper 4, an analytical description of the non-uniform power configuration can be found, as well as a numerical evaluation of the different power configurations discussed in Paper 3.

lt is concluded that communication between design engineers active in different spheres is a vital component for overcoming the thermal issues that are currently arising. Space must be provided in an early stage of product design phase for interdisciplinary thermal analysis and design. Furthermore, power distribution on a double-sided PCB is shown to be a thermal management measure without adding cost and weight to the electronic system. At moderate powers, maximum 36 W, and with equal power applied to all components on one side (uniform power configuration), this measure is confirmed to lower the maximum case temperature of the components by 4°C. Considering the more practical non-uniform power configuration, an even higher effect of power distribution can be achieved.

Place, publisher, year, edition, pages
Linköping: Linköpings universitet, 2005. 39 p.
Series
Linköping Studies in Science and Technology. Thesis, ISSN 0280-7971
Series
Linköping studies in science and technology. Thesis, 1177
National Category
Engineering and Technology
Identifiers
urn:nbn:se:liu:diva-28745 (URN)LiU-TEK-LIC-2005:32 (ISRN)13920 (Local ID)91-85299-77-4 (ISBN)13920 (Archive number)13920 (OAI)
Available from: 2009-10-09 Created: 2009-10-09 Last updated: 2016-12-22

Open Access in DiVA

No full text

Other links

Publisher's full text

Authority records BETA

Johansson, Jonas

Search in DiVA

By author/editor
Johansson, Jonas
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 278 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • oxford
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf