CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB
2007 (English)In: Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2007, IEEE , 2007, 233-243 p.Conference paper (Refereed)
Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.
Place, publisher, year, edition, pages
IEEE , 2007. 233-243 p.
, Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221 ; 2007
Avionics, thermal management, double-sided PCB, CFD, non-dominated designs
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:liu:diva-91902DOI: 10.1109/STHERM.2007.352429ISBN: 1-4244-09589-4 (print)ISBN: 1-4244-09589-4 (online)OAI: oai:DiVA.org:liu-91902DiVA: diva2:619549
23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007), March 18-22, San Jose, CA. USA