Atom insertion into grain boundaries and stress generation in physically vapor deposited films
2013 (English)In: Applied Physics Letters, ISSN 0003-6951, E-ISSN 1077-3118, Vol. 103, no 5Article in journal (Refereed) Published
We present evidence for compressive stress generation via atom insertion into grain boundaries in polycrystalline Mo thin films deposited using energetic vapor fluxes (<∼120 eV). Intrinsic stress magnitudes between −3 and +0.2 GPa are obtained with a nearly constant stress-free lattice parameter marginally larger (0.12%) than that of bulk Mo. This, together with a correlation between large compressive film stresses and high film densities, implies that the compressive stress is not caused by defect creation in the grains but by grain boundary densification. Two mechanisms for diffusion of atoms into grain boundaries and grain boundary densification are suggested.
Place, publisher, year, edition, pages
American Institute of Physics (AIP) , 2013. Vol. 103, no 5
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-98154DOI: 10.1063/1.4817669ISI: 000322723000036OAI: oai:DiVA.org:liu-98154DiVA: diva2:652279
Funding Agencies|COST Action|MP0804|Linkoping University||2013-09-302013-09-302014-04-08