CFD Analysis of an Avionic Module for Evaluating Power Distribution as a Thermal Management Measure for a Double-sided PCB
(English)Manuscript (preprint) (Other academic)
Thermal design aspects of an avionic module including fully populated PCBs housed in a sealed enclosure have been studied by means of computational fluid dynamics. Effect of power distribution between the sides of a double-sided PCB on the case temperature of surface-mounted components has been investigated within a proposed simulation strategy. Simulation-based guidelines have been developed for thermal design of avionic modules, regarding preferable power configuration on a double-sided PCB, representing an alternative approach to thermal management, as compared to introducing additional cooling devices.
Avionics, thermal management, double-sided PCB, CFD, non-dominated designs
Engineering and Technology
IdentifiersURN: urn:nbn:se:liu:diva-100821OAI: oai:DiVA.org:liu-100821DiVA: diva2:663766