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Influence of pulse power amplitude on plasma properties and film deposition in high power pulsed plasma enhanced chemical vapor deposition
University of Paris 11, France .
Linköping University, Department of Physics, Chemistry and Biology, Thin Film Physics. Linköping University, The Institute of Technology.
Linköping University, Department of Physics, Chemistry and Biology, Chemistry. Linköping University, The Institute of Technology.ORCID iD: 0000-0002-7171-5383
2014 (English)In: Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, ISSN 0734-2101, E-ISSN 1520-8559, Vol. 32, no 3Article in journal (Refereed) Published
Abstract [en]

The discharge characteristics in high power pulsed plasma enhanced chemical vapor deposition is studied with the aim to characterize the impact of high power pulses (HiPP). Using a power scheme of combined HiPP and direct current (DC) to ignite the plasma discharge, and adjusting the HiPP/DC time-averaged power ratio while keeping the total power constant, the effect of the high power pulses was isolated from the total power. By monitoring the discharge current along with the optical emission from the plasma, it is found that the amount of available ions increased with increasing HiPP/DC ratio, which indicates a higher plasma density. Using carbon films deposited from acetylene in an argon plasma as model system, a strong increase in deposition rate with higher HiPP/DC is observed. The increased deposition rate is ascribed to a more efficient plasma chemistry generated by the denser plasma.

Place, publisher, year, edition, pages
American Vacuum Society , 2014. Vol. 32, no 3
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Engineering and Technology
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URN: urn:nbn:se:liu:diva-107122DOI: 10.1116/1.4867442ISI: 000335965300002OAI: oai:DiVA.org:liu-107122DiVA: diva2:722015
Available from: 2014-06-05 Created: 2014-06-05 Last updated: 2017-12-05

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Jensen, JensPedersen, Henrik

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  • apa
  • harvard1
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