A carbon fiber solder matrix composite for thermalmanagement of microelectronic devices
2014 (English)In: Journal of Materials Chemistry C, ISSN 2050-7526, Vol. 2, no 35, 7184-7187 p.Article in journal (Refereed) Published
A carbon fiber based tin-silver-copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of ∼4 W m-1 K-1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m-1 K-1 in-plane and 20 ± 3 W m-1 K-1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W-1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.
Place, publisher, year, edition, pages
Royal Society of Chemistry, 2014. Vol. 2, no 35, 7184-7187 p.
Engineering controlled terms: Carbon fibers; Carbonization; Gold coatings; Metallic matrix composites; Microelectronics; Temperature control; Titanium alloys Mesophase pitch; Sputter coating; Temperature cycles; Thermal contact resistance; Thermal management applications; Thermal management of micro-electronic device; Through-plane thermal conductivities; Tin-silver-copper alloys Engineering main heading: Thermal conductivity of solids
IdentifiersURN: urn:nbn:se:liu:diva-109093DOI: 10.1039/C4TC00936CISI: 000341280000007ScopusID: 2-s2.0-84906076315OAI: oai:DiVA.org:liu-109093DiVA: diva2:736558