Temperature-Centric Reliability Analysis and Optimization of Electronic Systems under Process Variation
2015 (English)In: IEEE Transactions on Very Large Scale Integration (vlsi) Systems, ISSN 1063-8210, E-ISSN 1557-9999, Vol. 23, no 11, 2417-2430 p.Article in journal (Refereed) Published
Electronic system designs that ignore process variationare unreliable and inefficient. In this paper, we propose asystem-level framework for the analysis of temperature-inducedfailures that considers the uncertainty due to process variation.As an intermediate step, we also develop a probabilistic techniquefor dynamic steady-state temperature analysis. Given an electronicsystem under a certain workload, our framework deliversthe corresponding survival function, founded on the basis ofwell-established reliability models, with a closed-form stochasticparameterization in terms of the quantities that are uncertain atthe design stage. The proposed solution is exemplified consideringsystems with periodic workloads that suffer from the thermalcyclingfatigue. The analysis of this fatigue is a challengingproblem as it requires the availability of detailed temperatureprofiles, which are uncertain due to the variability of processparameters. To demonstrate the computational efficiency of ourframework, we undertake a design-space exploration procedureto minimize the expected energy consumption under a set oftiming, thermal, and reliability constraints.
Place, publisher, year, edition, pages
IEEE Computer Society, 2015. Vol. 23, no 11, 2417-2430 p.
Computer and Information Science
IdentifiersURN: urn:nbn:se:liu:diva-112694DOI: 10.1109/TVLSI.2014.2371249ISI: 000364209000006OAI: oai:DiVA.org:liu-112694DiVA: diva2:769519