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Thermal Challenges to Building Reliable Embedded Systems
Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, The Institute of Technology. (ESLAB)
2014 (English)In: Proc. International Symposium on VLSI Design, Automation and Test (VLSI-DAT’14), Hsinchu, Taiwan, Apr. 28-30, 2014., IEEE Press, 2014Conference paper, Published paper (Refereed)
Abstract [en]

More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.

Place, publisher, year, edition, pages
IEEE Press, 2014.
National Category
Computer and Information Science
Identifiers
URN: urn:nbn:se:liu:diva-117353DOI: 10.1109/VLSI-DAT.2014.6834936ISI: 000356616400078ISBN: 978-1-4799-2217-8 (print)OAI: oai:DiVA.org:liu-117353DiVA: diva2:807583
Conference
VLSI-DAT14
Available from: 2015-04-23 Created: 2015-04-23 Last updated: 2016-08-24

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
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  • modern-language-association-8th-edition
  • vancouver
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Output format
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