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Thermal Challenges to Building Reliable Embedded Systems
Linköping University, Department of Computer and Information Science, Software and Systems. Linköping University, Faculty of Science & Engineering.
2014 (English)In: PROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), IEEE , 2014Conference paper, Published paper (Refereed)
Abstract [en]

More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.

Place, publisher, year, edition, pages
IEEE , 2014.
National Category
Computer and Information Science
Identifiers
URN: urn:nbn:se:liu:diva-120892DOI: 10.1109/VLSI-TSA.2014.6839642ISI: 000358865800005ISBN: 978-1-4799-2217-8 (print)OAI: oai:DiVA.org:liu-120892DiVA: diva2:849322
Conference
International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
Available from: 2015-08-28 Created: 2015-08-28 Last updated: 2015-08-28

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CiteExportLink to record
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Citation style
  • apa
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