Thermal Challenges to Building Reliable Embedded Systems
2014 (English)In: PROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), IEEE , 2014Conference paper (Refereed)
More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.
Place, publisher, year, edition, pages
IEEE , 2014.
Computer and Information Science
IdentifiersURN: urn:nbn:se:liu:diva-120892DOI: 10.1109/VLSI-TSA.2014.6839642ISI: 000358865800005ISBN: 978-1-4799-2217-8OAI: oai:DiVA.org:liu-120892DiVA: diva2:849322
International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)