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Low temperature co-fired ceramic package for lab-on-a­chip applied in cell viability monitoring
University of Oulu, Finland. (Microelectronics and Material Physics Laboratories)
University of Oulu, Finland. (Microelectronics and Material Physics Laboratories)
University of Oulu, Finland. (Microelectronics and Material Physics Laboratories)
University of Maryland, Baltimore, USA. (Laboratory for MicroTechnologies, Department of Mechanical Engineering and the Institute for Systems Research)
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2015 (English)In: Proceedings Eurosensors 2015, 2015, 1187-1190 p.Conference paper, Poster (Refereed)
Place, publisher, year, edition, pages
2015. 1187-1190 p.
National Category
Physical Sciences
Identifiers
URN: urn:nbn:se:liu:diva-129112OAI: oai:DiVA.org:liu-129112DiVA: diva2:935770
Conference
Eurosensors 2015
Available from: 2016-06-12 Created: 2016-06-12 Last updated: 2016-06-28

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Möller, PeterLloyd Spetz, Anita
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Applied Sensor ScienceFaculty of Science & Engineering
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