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  • 1.
    Johansson, Christian
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Uhlig, Steffen
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Tageman, Ola
    Ericsson Microwave Systems AB, Mölndal, Sweden.
    Alping, Arne
    Ericsson Microwave Systems AB, Mölndal, Sweden.
    Haglund, Joacim
    Acreo AB, Norrköping, Sweden.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Popall, Michael
    Fraunhofer Institut für Silicatforschung, Würzburg, Germany.
    Fröhlich, Lothar
    Fraunhofer Institut für Silicatforschung, Würzburg, Germany.
    Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates2003In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 26, no 1, p. 81-89Article in journal (Refereed)
    Abstract [en]

    Requirements of higher performance, reduced size, weight and cost of high-frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also of interest are integrated packaging solutions for high frequency electrical packaging and optical interconnects and packaging. Sequentially build up multi-layers have been deposited on a low cost FR-4 epoxy substrate. The dielectric layers consist of a photo-patternable inorganic-organic hybrid polymer (ORMOCER) and the metallization is Cu. An UV-exposure equipment enabling projection patterning with 5 μm resolution have been used. The produced microstrip lines, ring resonators, vias, stacked capacitors and filters have been characterized at frequencies from 1 to 40 GHz showing the potential of the new dielectric materials and processing technologies for microwave applications.

  • 2.
    Karlsson, Magnus
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Håkansson, Pär
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Gong, Shaofang
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    A Frequency Triplexer for Ultra-wideband Systems Utilizing Combined Broadside- and Edge-coupled Filters2008In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 31, no 4, p. 794-801Article in journal (Refereed)
    Abstract [en]

    A fully integrated triplexer for multiband ultra-wideband radio is presented. The triplexer utilizes a microstrip network and three combined broadside- and edge-coupled filters. It is fully integrated in a printed circuit board with low requirements on the printed circuit board process tolerance. Three flat subbands in the frequency band 3.1-4.8 GHz have been achieved. The group delay variation within each 500-MHz subband was measured to be around 1 ns. A good agreement between simulation and measurement was obtained.

  • 3.
    Serban, Adriana
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Karlsson, Magnus
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Gong, Shaofang
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Compontent Tolerance Effect on Ultra-Wideband Low-Noise Amplifier Performance2010In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 33, no 3, p. 660-668Article in journal (Refereed)
    Abstract [en]

    A study of the component tolerances on an ultra-wideband low-noise amplifier designed on a conventional printed circuit board is presented in this paper. The low-noise amplifier design employs dual-section input and output microstrip matching networks for wideband operation with a low noise figure and a flat power gain. Firstly, the effect of passive component and manufacturing process tolerances on the low-noise amplifier performance is theoretically studied by means of sensitivity analyses. Secondly, simulation and measurement results are presented for verification of the analytical results. It is shown that, compared with a lumped matching network design, a microstrip matching network design significantly reduces the ultra-wideband low-noise amplifier sensitivity to component tolerances.

  • 4.
    Uhlig, Steffen
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Frohlich, L.
    Fröhlich, L., Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Chen, Miaoxiang
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Arndt-Staufenbiel, N.
    Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Lang, G.
    Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Schroder, H.
    Schröder, H., Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Houbertz, R.
    Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Popall, M.
    Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Polymer optical interconnects - A scalable large-area panel processing approach2006In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 29, no 1, p. 158-170Article in journal (Refereed)
    Abstract [en]

    A flexible approach to producing optical interconnects on 609.6 * 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 * 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6 * 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: = 50 µm * 10 µm) with refractive index step between core and cladding ?n = 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability. © 2006 IEEE.

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