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  • 1.
    Abdollahi Sani, Negar
    et al.
    Linköping University, Department of Science and Technology, Physics and Electronics. Linköping University, The Institute of Technology.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Cooper, Philip
    De La Rue Plc, Overton, Hampshire, UK .
    Wang, Xin
    Acreo AB, Norrköping, Sweden.
    Svensson, Magnus
    Acreo AB, Norrköping, Sweden.
    Andersson Ersman, Peter
    Acreo AB, Norrköping, Sweden.
    Norberg, Petronella
    Acreo AB, Norrköping, Sweden.
    Nilsson, Marie
    Acreo AB, Norrköping, Sweden.
    Nilsson, David
    Acreo AB, Norrköping, Sweden.
    Liu, Xianjie
    Linköping University, Department of Physics, Chemistry and Biology, Surface Physics and Chemistry. Linköping University, The Institute of Technology.
    Hesselbom, Hjalmar
    Hesselbom Innovation and Development HB, Huddinge, Sweden .
    Akesso, Laurent
    De La Rue Plc, Overton, Hampshire, UK .
    Fahlman, Mats
    Linköping University, Department of Physics, Chemistry and Biology, Surface Physics and Chemistry. Linköping University, The Institute of Technology.
    Crispin, Xavier
    Linköping University, Department of Science and Technology, Physics and Electronics. Linköping University, The Institute of Technology.
    Engquist, Isak
    Linköping University, Department of Science and Technology, Physics and Electronics. Linköping University, The Institute of Technology.
    Berggren, Magnus
    Linköping University, Department of Science and Technology, Physics and Electronics. Linköping University, The Institute of Technology. Acreo AB, Norrköping, Sweden.
    Gustafsson, Goran
    Acreo AB, Norrköping, Sweden.
    All-printed diode operating at 1.6 GHz2014In: Proceedings of the National Academy of Sciences of the United States of America, ISSN 0027-8424, E-ISSN 1091-6490, Vol. 111, no 33, p. 11943-11948Article in journal (Refereed)
    Abstract [en]

    Printed electronics are considered for wireless electronic tags and sensors within the future Internet-of-things (IoT) concept. As a consequence of the low charge carrier mobility of present printable organic and inorganic semiconductors, the operational frequency of printed rectifiers is not high enough to enable direct communication and powering between mobile phones and printed e-tags. Here, we report an all-printed diode operating up to 1.6 GHz. The device, based on two stacked layers of Si and NbSi2 particles, is manufactured on a flexible substrate at low temperature and in ambient atmosphere. The high charge carrier mobility of the Si microparticles allows device operation to occur in the charge injection-limited regime. The asymmetry of the oxide layers in the resulting device stack leads to rectification of tunneling current. Printed diodes were combined with antennas and electrochromic displays to form an all-printed e-tag. The harvested signal from a Global System for Mobile Communications mobile phone was used to update the display. Our findings demonstrate a new communication pathway for printed electronics within IoT applications.

  • 2.
    Chen, Miaoxiang
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Berggren, Magnus
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Remonen, Tommie
    Acreo AB, Norrköping.
    Kugler, Thomas
    Acreo AB, Norrköping.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Electrochemically Organic Rectifying Diodes Based on Flexible Substrates2003In: Material Research Society Spring Meeting,2003, 2003Conference paper (Refereed)
  • 3.
    Johansson, Christian
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Broadband dielectric characterization of a silicone elastomer2007In: Journal of Electronic Materials, ISSN 0361-5235, Vol. 36, no 9, p. 1206-1210Article in journal (Refereed)
    Abstract [en]

    The dielectric properties of an electronics grade silicone elastomer have been investigated in the frequency intervals 0.1 Hz to 1 MHz at −150°C to 100°C and from 7 GHz to 18 GHz at room temperature. The measurements were performed with a dielectric spectrometer for the low frequency range and with a waveguide setup for the high frequency range. The results are discussed in terms of performance and usability of the material in electronic packaging. Minor direct current (dc) conduction has been observed at high temperatures and is probably related to low levels (ppm) of ionic impurities.

  • 4.
    Johansson, Christian
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Microstrip stepped impedance filters with variable dielectric or variable width2005In: Electronics Letters, ISSN 0013-5194, Vol. 41, no 13, p. 745-746Article in journal (Refereed)
    Abstract [en]

    A stepped impedance filter has been realised on a modified substrate. The change in impedance was achieved by varying the dielectric constant in the substrate while maintaining a constant width of the microstrip. In contrast to conventional stepped impedance filters the impedance is varied by the dielectric constant instead of the microstrip line width. The manufactured filter was measured and compared with an equivalent conventional stepped impedance filter. It is shown that the modified substrate technology could offer an alternative to the standard approach for the stepped impedance filter. In combination with new materials with a high permittivity the technology could also offer a denser package since the microstrip width could be controlled as desired.

  • 5.
    Johansson, Christian
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Uhlig, Steffen
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Tageman, Ola
    Ericsson Microwave Systems AB, Mölndal, Sweden.
    Alping, Arne
    Ericsson Microwave Systems AB, Mölndal, Sweden.
    Haglund, Joacim
    Acrea AB, Norrköping, Sweden.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Popall, Michael
    Fraunhofer-Institut fuer Silicatforschung, Wuerzburg, Germany.
    Microwave circuits in multilayer ORMOCER® thin film2002In: Proceedings IMAPS Nordic 2002, 2002, p. 60-63Conference paper (Other academic)
    Abstract [en]

    A multilayer sequential build-up structure for the integration of passivemicrowave devices is presented. The different devices were processed byusing a photo-patternable polymer ORMOCER together with conducting layersof Cu on top of a FR-4 substrate. Microstrip and stub structures have beencharacterised at frequencies between 1 to 40 GHZ showing the feasibility ofusing this kind of material and build-up technology for microwaveapplications.

  • 6.
    Johansson, Christian
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Uhlig, Steffen
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Tageman, Ola
    Ericsson Microwave Systems AB, Mölndal, Sweden.
    Alping, Arne
    Ericsson Microwave Systems AB, Mölndal, Sweden.
    Haglund, Joacim
    Acreo AB, Norrköping, Sweden.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Popall, Michael
    Fraunhofer Institut für Silicatforschung, Würzburg, Germany.
    Fröhlich, Lothar
    Fraunhofer Institut für Silicatforschung, Würzburg, Germany.
    Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates2003In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 26, no 1, p. 81-89Article in journal (Refereed)
    Abstract [en]

    Requirements of higher performance, reduced size, weight and cost of high-frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also of interest are integrated packaging solutions for high frequency electrical packaging and optical interconnects and packaging. Sequentially build up multi-layers have been deposited on a low cost FR-4 epoxy substrate. The dielectric layers consist of a photo-patternable inorganic-organic hybrid polymer (ORMOCER) and the metallization is Cu. An UV-exposure equipment enabling projection patterning with 5 μm resolution have been used. The produced microstrip lines, ring resonators, vias, stacked capacitors and filters have been characterized at frequencies from 1 to 40 GHz showing the potential of the new dielectric materials and processing technologies for microwave applications.

  • 7.
    Johansson, Christian
    et al.
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Wang, Xiaodong
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Robertsson, Mats
    Linköping University, Department of Science and Technology. Linköping University, The Institute of Technology.
    Printable rectifying device using Si-composite2008In: Electronics Letters, ISSN 0013-5194, E-ISSN 1350-911X, Vol. 44, no 1, p. 53-55Article in journal (Refereed)
    Abstract [en]

    The R&D in finding low-cost manufacturing of electronics and electronic components is intense. One research route is aiming at roll-to-roll printing of organic electronics but the typically low mobility in organic semiconductors results in fundamental difficulties to fabricate, e.g., diodes for operation at high frequencies. A novel diode has instead been realised by screen-printing a silicon-powder composite with the intention to utilise the high mobility and the high operation frequency potential of silicon. The current against voltage (I-V) characteristics of the printed device reveal diode behaviour but so far with a too high ideality factor and resistance to be practically useful. By optimising device geometry, composite, and printing process low-cost printed, high frequency diodes (MHz-some GHz) may be viable.

  • 8.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    NETPACK Visions Lab - visions, presentations, opinions, facts & challenges related to future microelectronic packaging2004In: International Microelectronics and Packaging Society Conference - Nordic Chapter,2004, 2004Conference paper (Other academic)
  • 9.
    Uhlig, Steffen
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Domann, G.
    Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Houbertz, R.
    Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Frohlich, L.
    Fröhlich, L., Ratiochem GmbH, Untersteinach D-95369, Germany.
    Schroder, H.
    Schröder, H., Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Krissler, J.
    Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Lang, G.
    Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Preventing of dewetting effects for inorganic-organic hybrid polymers applied in sequentially buildup (SBU) technology without surface pretreatments2006In: IEEE transactions on electronics packaging manufacturing (Print), ISSN 1521-334X, E-ISSN 1558-0822, Vol. 29, no 4, p. 297-307Article in journal (Refereed)
    Abstract [en]

    Upon processing waveguide structures by using the ORMOCER materials ORMOCORE as core material, and a mixture of ORMOCORE and ORMOCER-III (refractive index tuning agent) as cladding material, dewetting effects of the core layer from the cladding layer were observed. A similar phenomenon was observed for a mixture of ORMOCORE and ORMOCLAD which was used as comparative refractive index tuning material. In order to use these material combinations for large-area panel (LAP) processing, a pretreatment or activation of surfaces is necessary but hard to realize. However, the addition of small amounts of ORMOCER-III or ORMOCLAD, respectively, to the core layer material, prevented the dewetting phenomenon. The objective of this, however, is to minimize the content of refractive index tuning agent in the core layer by retaining a good wetting behavior during multilayer processing. Wet film stability tests and contact angle measurements of these ORMOCER systems in various compositions on another ORMOCER surface of a specific cladding material composition were performed on a hotplate. Furthermore, contact angles of droplets formed by deionized water, formamide, and di-iodomethane on cured surfaces of these ORMOCER systems in a wide range of compositions were characterized, and surface tensions were calculated. By adding 0.1 wt% of ORMOCER-III or 5 wt% ORMOCLAD, respectively, to the pure ORMOCORE solution, the dewetting phenomenon was eliminated, while simultaneously the refractive index was affected only to a minor degree and no changes in the optical loss could be detected. It was shown that by adding ORMOCER-III or ORMOCLAD to pure ORMOCORE, the surface tension of the compound system was reduced. In comparison to silanization or gasplasma treatment to overcome dewetting effects in microelectronics multilayer processing, the investigated mixing method eliminates process steps and thus costs, and opens new process routes for LAP processing. © 2006 IEEE.

  • 10.
    Uhlig, Steffen
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Frohlich, L.
    Fröhlich, L., Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Chen, Miaoxiang
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Arndt-Staufenbiel, N.
    Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Lang, G.
    Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Schroder, H.
    Schröder, H., Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin D-13355, Germany.
    Houbertz, R.
    Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Popall, M.
    Fraunhofer-Institut für Silicatforschung, Würzburg D-97082, Germany.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Polymer optical interconnects - A scalable large-area panel processing approach2006In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 29, no 1, p. 158-170Article in journal (Refereed)
    Abstract [en]

    A flexible approach to producing optical interconnects on 609.6 * 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 * 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6 * 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: = 50 µm * 10 µm) with refractive index step between core and cladding ?n = 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability. © 2006 IEEE.

  • 11.
    Uhlig, Steffen
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Flip chip mountable optical waveguide amplifier for optical backplane systems2005In: Electronic Components and Technology Conference ECTC,2005, conference proceedings: IEEE , 2005, p. 1880-Conference paper (Refereed)
  • 12.
    Uhlig, Steffen
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Limitations to and solutions for optical loss in optical backplanes2006In: Journal of Lightwave Technology, ISSN 0733-8724, E-ISSN 1558-2213, Vol. 24, no 4, p. 1710-1724Article, review/survey (Refereed)
    Abstract [en]

    In this paper, recent literature on the discussion on high-speed backplanes with optical, electrical, and mixed solutions, as well as on polymer-waveguide systems suitable for implementation on printed circuit boards (PCBs), is reviewed from the point of view of their optical losses. The reevaluation of the optical power budget for realistic high-speed optical polymer-waveguide links on backplanes showed that signal amplification is necessary to boost the signal, which resulted in an additional literature review on advances in optical amplifiers based on silicon bench technology available. Finally, a concept study of an active optical waveguide amplifier device, based on planar optical waveguide amplifiers and semiconductor optical amplifiers, was performed. The amplification device can be flip-chip mounted on the backplane to compensate for optical losses due to signal routing, which increases the overall degree of freedom in waveguide routing on high-density interconnects for backplanes. The hybrid concept design guarantees compatibility with the processes of the PCB industry. © 2006 IEEE.

  • 13.
    Uhlig, Steffen
    et al.
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Robertsson, Mats
    Linköping University, The Institute of Technology. Linköping University, Department of Science and Technology.
    Schröder, H.
    Fraunhofer Institute for Reliability and Microintegration, IZM, Germany.
    Lang, G.
    Fraunhofer Institute for Reliability and Microintegration, IZM, Germany.
    Arndt-Staufenbiel, N.
    Fraunhofer Institute for Reliability and Microintegration, IZM, Germany.
    Popall, M.
    Fraunhofer Institute for Silicate Research, ISC, Germany.
    Fröhlich, L.
    Fraunhofer Institute for Silicate Research, ISC, Germany.
    Houbertz, R.
    Fraunhofer Institute for Silicate Research, ISC, Germany.
    Large-area processing of inorganic-organic hybrid polymers (ORMOCER-Reg Trademark) for optical backplane application2004In: International Convention on Glass 2004,2004, 2004Conference paper (Other academic)
1 - 13 of 13
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