ScN is an emerging semiconductor with an indirect bandgap. It has attracted attention for its thermoelectric properties, use as seed layers, and for alloys for piezoelectric application. ScN and other transition metal nitride semiconductors used for their interesting electrical properties are sensitive to contaminants, such as oxygen or fluorine. In this present article, the influence of depositions conditions on the amount of oxygen contaminants incorporated in ScN films were investigated and their effects on the electrical properties (electrical resistivity and Seebeck coefficient) were studied. Epitaxial-like films of thickness 125 +/- 5 nm to 155 +/- 5 nm were deposited by DC-magnetron sputtering on c-plane Al-2, O-3(111) and r-plane Al2O3 at substrate temperatures ranging from 700 degrees C to 950 degrees C. The amount of oxygen contaminants in the film, dissolved into ScN or as an oxide, was related to the adatom mobility during growth, which is affected by the deposition temperature and the presence of twin domain growth. The lowest values of electrical resistivity of 50 mu Omega cm were obtained on ScN(1 1 1)/ MgO(111) and on ScN(001)/r-plane Al2O3 grown at 950 degrees C with no twin domains and the lowest amount of oxygen contaminant. At the best, the films exhibited an electrical resistivity of 50 mu Omega cm with Seebeck coefficient values maintained at -40 mu V K-1, thus a power factor estimated at 3.2 x 10(-3) W m(-1) K-2 (at room temperature).
For applications in energy harvesting and environmentally friendly cooling, and for power sources in remote or portable applications, it is desired to enhance the efficiency of thermoelectric materials. One strategy consists of reducing the thermal conductivity while increasing or retaining the thermoelectric power factor. An approach to achieve this is doping to enhance the Seebeck coefficient and electrical conductivity, while simultaneously introducing defects in the materials to increase phonon scattering. Here, we use Mg ion implantation to induce defects in epitaxial ScN (111) films. The films were implanted with Mg+ ions with different concentration profiles along the thickness of the film, incorporating 0.35 to 2.2 at. % of Mg in ScN. Implantation at high temperature (600 degrees C), with few defects due to the temperature, does not substantially affect the thermal conductivity compared to a reference ScN. Samples implanted at room temperature, in contrast, exhibited a reduction of the thermal conductivity by a factor of 3. The sample doped with 2.2 at. % of Mg also showed an increased power factor after implantation. This paper thus shows the effect of ion-induced defects on thermal conductivity of ScN films. High-temperature implantation allows the defects to be annealed out during implantation, while the defects are retained for room-temperature implanted samples, allowing for a drastic reduction in thermal conductivity.
ScN-rich (Sc,Nb)N solid solution thin films have been studied, motivated by the promising thermoelectric properties of ScN-based materials. Cubic Sc1-xNbxN films for 0 amp;lt;= x amp;lt;= 0.25 were epitaxially grown by DC reactive magnetron sputtering on a c-plane sapphire substrate and oriented along the (111) orientation. The crystal structure, morphology, thermal conductivity, and thermoelectric and electrical properties were investigated. The ScN reference film exhibited a Seebeck coefficient of -45 mu V/K and a power factor of 6 x 10(-4) W/m K-2 at 750K. Estimated from room temperature Hall measurements, all samples exhibit a high carrier density of the order of 10(21) cm(-3). Inclusion of heavy transition metals into ScN enables the reduction in thermal conductivity by an increase in phonon scattering. The Nb inserted ScN thin films exhibited a thermal conductivity lower than the value of the ScN reference (10.5W m(-1) K-1) down to a minimum value of 2.2 Wm(-1) K-1. Insertion of Nb into ScN thus resulted in a reduction in thermal conductivity by a factor of similar to 5 due to the mass contrast in ScN, which increases the phonon scattering in the material. Published by AIP Publishing.