The angular dependence of the deposition rates due to ions and neutrals in high-power impulse magnetron sputtering (HiPIMS) discharges with a titanium target were determined experimentally using a magnetically shielded and charge-selective quartz crystal microbalance (or ionmeter). These rates have been established as a function of the argon working gas pressure, the peak discharge current density, and the pulse length. For all explored cases, the total deposition rate exhibits a heart-shaped profile and the ionized flux fraction peaks on the discharge axis normal to the cathode target surface. This heart-shaped pattern is found to be amplified at increasing current densities and reduced at increased working gas pressures. Furthermore, it is confirmed that a low working gas pressure is beneficial for achieving high deposition rates and high ionized flux fractions in HiPIMS operation.

Here, we compare the ionization region model (IRM) against experimental measurements of particle densities and electron temperature in a high power impulse magnetron sputtering discharge with a tungsten target. The semi-empirical model provides volume-averaged temporal variations of the various species densities as well as the electron energy for a particular cathode target material, when given the measured discharge current and voltage waveforms. The model results are compared to the temporal evolution of the electron density and the electron temperature determined by Thomson scattering measurements and the temporal evolution of the relative neutral and ion densities determined by optical emission spectrometry. While the model underestimates the electron density and overestimates the electron temperature, the temporal trends of the species densities and the electron temperature are well captured by the IRM.

In magnetron sputtering, only a fraction of the sputtered target material leaving the ionization region is directed toward the substrate. This fraction may be different for ions and neutrals of the target material as the neutrals and ions can exhibit a different spread as they travel from the target surface toward the substrate. This difference can be significant in high power impulse magnetron sputtering (HiPIMS) where a substantial fraction of the sputtered material is known to be ionized. Geometrical factors or transport parameters that account for the loss of produced film-forming species to the chamber walls are needed for experimental characterization and modeling of the magnetron sputtering discharge. Here, we experimentally determine transport parameters for ions and neutral atoms in a HiPIMS discharge with a titanium target for various magnet configurations. Transport parameters are determined to a typical substrate, with the same diameter (100 mm) as the cathode target, and located at a distance 70 mm from the target surface. As the magnet configuration and/or the discharge current are changed, the transport parameter for neutral atoms xi(tn) remains roughly the same, while transport parameters for ions xi(ti) vary greatly. Furthermore, the relative ion-to-neutral transport factors, xi(ti)/xi(tn), that describe the relative deposited fractions of target material ions and neutrals onto the substrate, are determined to be in the range from 0.4 to 1.1.

The ionization region model (IRM) is applied to model high power impulse magnetron sputtering (HiPIMS) discharges with a Cu target. We apply the model to three discharges that were experimentally explored in the past, or applied to deposit thin copper films, with the aim to quantify internal plasma process parameters and thereby understand how these discharges differ from each other. The temporal variation of the various neutral and ionic species, the electron density and temperature, as well as internal discharge parameters, such as the ionization probability, back attraction probability, and ionized flux fraction of the sputtered species, are determined. We demonstrate that the Cu+ ions dominate the total ion current to the target surface and that all the discharges are dominated by self-sputter recycling to reach high discharge currents. Furthermore, the ion flux into the diffusion region is dominated by Cu+ ions, which represents roughly 80% of the total ion flux onto the substrate, in agreement with experimental findings. For the discharges operated with peak discharge current densities in the range 0.9 - 1.3 A cm-2, the ion back-attraction probability of the Cu+ ion (beta t) is low compared to previously investigated HiPIMS discharges, or in the range 44 - 50%, while the ionization probability (alpha t) is in the range 61 - 69%, and the ionized flux fraction is in the range 32 - 40%. It is, furthermore, found that operating these Cu HiPIMS discharges at lower working gas pressures (in the present case around 0.5 Pa) is beneficial in terms of optimizing ionization of the sputtered species.

The ionization region model (IRM) is applied to model a high power impulse magnetron sputtering discharge with a tungsten target. The IRM gives the temporal variation of the various species and the average electron energy, as well as internal discharge parameters such as the ionization probability and the back-attraction probability of the sputtered species. It is shown that an initial peak in the discharge current is due to argon ions bombarding the cathode target. After the initial peak, the W+ ions become the dominating ions and remain as such to the end of the pulse. We demonstrate how the contribution of the W+ ions to the total discharge current at the target surface increases with increased discharge voltage for peak discharge current densities J (D,peak) in the range 0.33-0.73 A cm(-2). For the sputtered tungsten the ionization probability increases, while the back-attraction probability decreases with increasing discharge voltage. Furthermore, we discuss the findings in terms of the generalized recycling model and compare to experimentally determined deposition rates and find good agreement.

Magnetron sputtering combines a glow discharge with sputtering from a target that simultaneously serves as a cathode for the discharge. The electrons of the discharge are confined between overarching magnetic field lines and the negatively biased cathode. As the target erodes during the sputter process, the magnetic field strengthens in the cathode vicinity, which can influence discharge parameters with the risk of impairing reproducibility of the deposition process over time. This is of particular concern for high-power impulse magnetron sputtering (HiPIMS) as the discharge current and voltage waveforms vary strongly with the magnetic field strength. We here discuss ways to limit the detrimental effect of target erosion on the film deposition process by choosing an appropriate mode of operation for the discharge. The goal is to limit variations of two principal flux parameters, the deposition rate and the ionized flux fraction. As an outcome of the discussion, we recommend operating HiPIMS discharges by maintaining the peak discharge current constant.