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Elucidating dislocation core structures in titanium nitride through high-resolution imaging and atomistic simulations
Linköping University, Department of Physics, Chemistry and Biology, Nanostructured Materials. Linköping University, Faculty of Science & Engineering.
Linköping University, Department of Physics, Chemistry and Biology, Theoretical Physics. Linköping University, Faculty of Science & Engineering.ORCID iD: 0000-0002-1379-6656
The Interdisciplinary Centre for Advanced Materials Simulation (ICAMS), Ruhr-Universität Bochum, Bochum, Germany.
Sandvik Coromant AB, Stockholm, Sweden.
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2022 (English)In: Materials & design, ISSN 0264-1275, E-ISSN 1873-4197, Vol. 224, article id 111327Article in journal (Refereed) Published
Abstract [en]

Although titanium nitride (TiN) is among the most extensively studied and thoroughly characterizedthin-film ceramic materials, detailed knowledge of relevant dislocation core structures is lacking. Byhigh-resolution scanning transmission electron microscopy (STEM) of epitaxial single crystal (001)-oriented TiN films, we identify different dislocation types and their core structures. These include, besidesthe expected primary a/2{110}h110i dislocation, Shockley partial dislocations a/6{111}h112i and sessileLomer edge dislocations a/2{100}h011i. Density-functional theory and classical interatomic potentialsimulations complement STEM observations by recovering the atomic structure of the different disloca-tion types, estimating Peierls stresses, and providing insights on the chemical bonding nature at the core.The generated models of the dislocation cores suggest locally enhanced metal–metal bonding, weakenedTi-N bonds, and N vacancy-pinning that effectively reduces the mobilities of {110}h110i and {111}h112idislocations. Our findings underscore that the presence of different dislocation types and their effects onchemical bonding should be considered in the design and interpretations of nanoscale and macroscopicproperties of TiN.

Place, publisher, year, edition, pages
Elsevier, 2022. Vol. 224, article id 111327
National Category
Other Materials Engineering
Identifiers
URN: urn:nbn:se:liu:diva-190768DOI: 10.1016/j.matdes.2022.111327ISI: 001013908300001Scopus ID: 2-s2.0-85141335848OAI: oai:DiVA.org:liu-190768DiVA, id: diva2:1722772
Projects
FunMat-II
Funder
Uppsala University, 2009-00971Swedish Foundation for Strategic ResearchVinnova, 2016-05156Swedish Research Council, VR-2015-04630Knut and Alice Wallenberg Foundation, KAW-2018.0194
Note

Funding: Swedish Research Council [2017-03813, 2017-06701, 2021-04426, 202100357, 2019-00191]; VINNOVA [2016-05156]; Swedish government strategic research area grant AFM -SFO MatLiU [2009-00971]; Knut and Alice Wallenberg Foundation (Wallenberg Scholar grant) [KAW-2018.0194]; Swedish Research Council [2017-03813] Funding Source: Swedish Research Council

Available from: 2022-12-30 Created: 2022-12-30 Last updated: 2026-01-20Bibliographically approved
In thesis
1. Defects in Titanium Aluminum Nitride-Based Thin Films
Open this publication in new window or tab >>Defects in Titanium Aluminum Nitride-Based Thin Films
2023 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Coatings and thin films inherently contain several types of defects. This thesis aims to enhance the understanding of the relationship of defects on the growth, structure, stability, and properties of titanium aluminum nitride films synthesized by physical vapor deposition techniques.

Heteroepitaxial cubic and wurtzite films in the Ti-Al-N system grown by reactive magnetron sputtering were studied in relation to their defect structures. The dislocation structures of heteroepitaxial TiN and Ti1-xAlxNy films were analyzed by high-angle annular dark field scanning transmission electron microscopy (HAADF-STEM). Together with atomistic simulations, it was revealed that the presence of different dislocation types in TiN enhances the metal-metal bonds which locally weakens the directionally covalent metal-N bonds. In epitaxial cubic Ti1-xAlxN films, microstrain analysis shows that increasing N-vacancies influences the strain and compositional fluctuations in as-deposited states. During spinodal decomposition induced by annealing to high temperatures, the delay in coarsening and strain correlates with the amount of N vacancies. Detailed characterization of the decomposing domains exposed the formation of stacking faults and partial dislocations as a strain-relieving mechanism which also facilitates the known cubic-to-wurtzite transformation in Ti-Al-N.

Cathodic arc deposited Ti1-xAlxN films were grown by applying a low duty cycle pulsed-substrate bias and high nitrogen pressures. This resulted into films with coarse grains and low lattice defects within them, indicating a kinetically controlled route to modify the defect structures in arc-deposited films. Applying the same technique on single crystalline TiN seed layer films kinetically stabilizes a pseudomorphic growth, allowing to form a highly textured, pseudo epitaxial wurtzite Ti1-xAlxN films by arc deposition. In combination with theoretical calculations, it was revealed that w-Ti1-xAlxN films also exhibit a miscibility gap which enables spinodal decomposition and thus age hardening when annealed. Finally, magnetron sputtered nitrogen-deficient w-Ti1-xAlxNy heteroepitaxial films were shown to exhibit a decomposition route that involves the formation of coherent intermediate MAX-like phases before transforming to pure c-TiN and w-AlN phases, which results to continued age hardening up to 1200°C.

The findings in this work increase the fundamental understanding of the role of defects in Ti-Al-N films and open new routes for defect-based engineering strategies.

Place, publisher, year, edition, pages
Linköping: Linköping University Electronic Press, 2023. p. 77
Series
Linköping Studies in Science and Technology. Dissertations, ISSN 0345-7524 ; 2291
Keywords
Thin films, Ti-Al-N, Defects, Physical vapor deposition
National Category
Manufacturing, Surface and Joining Technology
Identifiers
urn:nbn:se:liu:diva-191599 (URN)10.3384/9789180750608 (DOI)9789180750592 (ISBN)9789180750608 (ISBN)
Public defence
2023-03-03, C3, C Building, Campus Valla, Linköping, 09:15 (English)
Opponent
Supervisors
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Vinnova
Available from: 2023-02-03 Created: 2023-02-03 Last updated: 2023-02-03Bibliographically approved

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Salamania, JanellaSangiovanni, Davide GiuseppeBoyd, RobertBakhit, BabakHsu, Tun-WeiRogström, LinaTasnadi, FerencAbrikosov, Igor A.Odén, Magnus

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Salamania, JanellaSangiovanni, Davide GiuseppeBoyd, RobertBakhit, BabakHsu, Tun-WeiRogström, LinaTasnadi, FerencAbrikosov, Igor A.Odén, Magnus
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