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Thermo-Mechanical Analysis and Optimization of PCBs: A Study on Strain Reduction in Automotive Camera Assemblies
Linköping University, Department of Management and Engineering, Product Realisation.
Linköping University, Department of Management and Engineering, Product Realisation.
2025 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesisAlternative title
Termo-mekanisk analys och designoptimering av kretskort (Swedish)
Abstract [en]

A printed circuit board (PCB) mounted inside of a housing will experience more thermal strain when subjected to temperature compared to a non-mounted PCBs. This is due to a mismatch of the coefficient of thermal expansion (CTE) between the aluminium housing and FR-4 used in the PCB. This is a common problem in the automotive industry as the temperature intervals the PCB is expected to endure are large. In this report, f inite element analysis was used for simulating how the strain induced by CTE-mismatch spreads in the PCB relative to its temperature cycle. The concept of using slots were investigated further as a way to reduce the strains. Different slot designs were analysed using multi-disciplinary design optimization and then simulated to verify their effectiveness. It was discovered that the optimization algorithm favours slots that separates the PCB corner as much as possible from the rest of the PCB. Each slot was then analysed further, by incorporating each design into the created finite element model, and using different metrics, determine which slot preforms the best and why. The conclusions were that optimization could be a useful tool to investigate different slot designs, where some design parameters were favoured more than others. Furthermore, the use of slots indicated that strain can be significantly reduced, upwards of 27% near corner screw holes, depending on measurement.

Abstract [sv]

Ett kretskort (PCB) som är monterat inuti en kapsling utsätts för större termiska påfrestningar vid temperaturvariationer jämfört med ett omonterat mönsterkort. Detta beror på en skillnad i termisk utvidgningskoefficient (CTE) mellan aluminiumkapslingen och FR-4-materialet som används i kortet. Problemet är vanligt förekommande inom fordonsindustrin, där mönsterkort ofta måste tåla stora temperaturintervall. I denna rapport användes finita element-metoden (FEM) för att simulera hur påfrestningar orsakade av CTE-missanpassning sprider sig i mönsterkortet under dess termiska cykel. Användningen av slots undersöktes som en metod för att minska dessa påfrestningar.

Olika slotdesigner analyserades med hjälp av multidisciplinär designoptimering och simulerades därefter för att verifiera deras effektivitet. Det visade sig att optimeringsalgoritmen föredrog slots som i största möjliga mån separerar hörnet av mönsterkortet från resten av kortet. Varje slotdesign analyserades vidare genom att integrera dem i den skapade FEM-modellen och med hjälp av olika mätvärden avgöra vilken design som presterade bäst och varför.

Slutsatserna var att optimering kan vara ett användbart verktyg för att undersöka olika slotdesigner, där vissa designparametrar visade sig vara mer fördelaktiga än andra. Vidare visade användningen av skåror att påfrestningarna kan minska avsevärt (upp till 27 % i närheten av hörnskruvhål) beroende på mätmetod.

Place, publisher, year, edition, pages
2025. , p. 86
Keywords [en]
Aluminium, Automotive, CTE, Electronics, FR4, Housing, Mounting, Optimization, Packaging, PCB, Reliability, Simulation, Slots, Strain, FEM, FEA, CATIA
Keywords [sv]
Aluminium, bilindustri, elektronikkonstruktion, förpackning, hållfasthet, kapsling, mekanisk påkänning, montering, optimering, PCB, pålitlighet, simulering, skåror, spänning, värmeutvidgning
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:liu:diva-215709ISRN: LIU-IEI-TEK-A--25/05069--SEOAI: oai:DiVA.org:liu-215709DiVA, id: diva2:1977816
External cooperation
Magna Electronics AB
Subject / course
Mechanical Engineering
Presentation
2025-06-02, Linköping, 15:40 (Swedish)
Supervisors
Examiners
Available from: 2025-07-04 Created: 2025-06-26 Last updated: 2025-07-04Bibliographically approved

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1314151617181916 of 553
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