Printed circuit boards (PCBs) are often the critical link between electrical components and modern products. During operation, these components release heat, increasing the overall temperature of the PCB. Managing this temperature is important because elevated heat can shorten the lifespan of components, which often have a limited temperature tolerance range. Heat sinks and fans can help with the cooling but are limited by space constraints. 

Examining the thermal resistance in PCBs offers a potential solution to minimize the temperature increase during operation. This study utilizes a digital twin approach, which includes computational fluid dynamics (CFD) analysis and experimental validation, to evaluate various PCB configurations and their impact on thermal performance. Specifically, the simulations focused on two different via patterns, the thickness of copper layers, the presence or absence of copper balance, and varying thicknesses of dielectric layers.

The results indicate that increasing the copper content in the PCB improves heat distribution, and including copper balance reduces the temperature, thereby decreasing thermal resistance. These findings suggest that while PCBs can function as minor heat sinks, further investigation is needed to understand the implications of the dielectric layers.

This research addresses the thermal management capabilities of PCBs and highlights the efficacy of digital twin methodologies in predicting thermal behavior. The findings contribute to the field by showing that making strategic changes to PCB design can improve heat dissipation, which may extend the operational lifespan of electronic components.