Characterization of Drain-Induced Barrier Lowering in GaN HEMTs Using a Drain Current Injection TechniqueShow others and affiliations
2024 (English)In: IEEE Transactions on Electron Devices, ISSN 0018-9383, E-ISSN 1557-9646, Vol. 71, no 12, p. 7383-7389Article in journal (Refereed) Published
Abstract [en]
Assessing short channel effects (SCEs) is crucial in the high-frequency optimization of downscaled field-effect transistors (FETs) such as GaN high electron mobility transistors (HEMTs). Drain-induced barrier lowering (DIBL) is commonly used for quantifying the ability of the gate to modulate the drain-source current at high drain voltages. DIBL is traditionally extracted from the relative shift of the threshold voltage at different drain-source voltages. In this article, we propose a new method based on a drain current injection technique (DCIT) to assess DIBL. This method facilitates a direct measure of the threshold voltage over a wide range of drain-source voltages in a single measurement. The method is demonstrated and compared to the conventional method using AlGaN/GaN and InAlGaN HEMTs with a Fe-doped buffer and a C-doped AlGaN back-barrier, respectively. Furthermore, the impact of different gate lengths and GaN channel layer thicknesses is presented. The measurements are analyzed and discussed with supporting technology computer-aided design (TCAD) simulations. The proposed method facilitates a more general and detailed measurement of the DIBL for HEMTs.
Place, publisher, year, edition, pages
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC , 2024. Vol. 71, no 12, p. 7383-7389
Keywords [en]
MODFETs; Logic gates; HEMTs; Wide band gap semiconductors; Aluminum gallium nitride; Voltage measurement; Electrons; Threshold voltage; Semiconductor device measurement; Physics; Drain current injection technique (DCIT); drain-induced barrier lowering (DIBL); GaN; high electron mobility transistor (HEMT); short-channel effect (SCE)
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:liu:diva-210166DOI: 10.1109/TED.2024.3489592ISI: 001358191900001Scopus ID: 2-s2.0-85209913838OAI: oai:DiVA.org:liu-210166DiVA, id: diva2:1917641
Note
Funding Agencies|Competence Center for III-Nitride Technology C3NiT-Janzen; Swedish Governmental Agency for Innovation Systems (VINNOVA) through the Competence Center Program [2016-05190, 2022-03139]; Linkoeping University; Chalmers University of Technology; Lund University; Ericsson; Epiluvac; Swedish Defense Materiel Administration (FMV); Gotmic; Hexagem; Hitachi Energy, Saab; SweGaN; United Monolithic Semiconductors (UMS); Volvo Cars; Swedish Foundation for Strategic Research [STP19-0008]
2024-12-032024-12-032025-10-07Bibliographically approved