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High-performance and low-power challenges for sub-70nm microprocessor circuits
Intel Corporation, Hillsboro, USA.
Linköping University, Department of Electrical Engineering, Electronic Devices. Linköping University, The Institute of Technology.ORCID iD: 0000-0001-8922-2360
Intel Corporation, Hillsboro, USA.
Intel Corporation, Hillsboro, USA.
2002 (English)In: Proceedings of the IEEE Custom Integrated Circuits Conference, 2002, p. 125-128Conference paper, Published paper (Refereed)
Abstract [en]

CMOS technology scaling is becoming difficult beyond 70nm node, raising new design challenges for highperformance and low-power microprocessors. This paper discusses some of the key paradigm shifts required. Circuit techniques to combat (i) increasing switching and leakage power dissipation, (ii) poor leakage tolerance of large-signal cache arrays and register files, and (iii) worsening global on-chip interconnect scaling trend, are described.

Place, publisher, year, edition, pages
2002. p. 125-128
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:liu:diva-54008OAI: oai:DiVA.org:liu-54008DiVA, id: diva2:296808
Conference
IEEE Custom Integrated Circuits Conference
Available from: 2010-02-18 Created: 2010-02-18 Last updated: 2019-09-05

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Alvandpour, Atila

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